IPC
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- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.13
Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring
- 【Date】1985/10/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3.24.1
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
- 【Date】1985/10/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC NC-349
Computer Numerical Control Formatting for Drillers and Routers
- 【Date】1985/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC NC-349 CD
Computer Numerical Control Formatting for Drillers and Routers
- 【Date】1985/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC D-352
Electronic Design Data Description for Printed Boards in Digital Form
- 【Date】1985/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC D-352 CD
Electronic Design Data Description for Printed Boards in Digital Form
- 【Date】1985/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC D-351
Printed Board Drawings in Digital Form
- 【Date】1985/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC D-351 CD
Printed Board Drawings in Digital Form
- 【Date】1985/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.18A
Low Temperature Flexibility, Flexible Printed Wiring Materials
- 【Date】1985/7/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.16
Pressure Vessel Method for Glass Epoxy Laminate Integrity
- 【Date】1985/7/1
- 【Language】English
- 【Status】Active