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- 【Organization】DIN
- 【Document #】DIN 66030
Information technology - Representation of SI and other units in systems with limited character sets
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN EN 50201
Interfaces for DVB-IRD; German version EN 50201:2001
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN ISO 965-4
ISO general purpose metric screw threads - Tolerances - Part 4: Limits of sizes for hot-dip galvanized external screw threads to mate with internal screw threads tapped with tolerance position H or G after galvanizing (ISO 965-4:1998)
- 【Date】2002/5/1
- 【Language】English
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN ISO 965-4
ISO general purpose metric screw threads - Tolerances - Part 4: Limits of sizes for hot-dip galvanized external screw threads to mate with internal screw threads tapped with tolerance position H or G after galvanizing (ISO 965-4:1998)
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN ISO 965-5
ISO general purpose metric screw threads - Tolerances - Part 5: Limits of sizes for internal screw threads to mate with hot-dip galvanized external screw threads with maximum size of tolerance position h before galvanizing (ISO 965-5:1998)
- 【Date】2002/5/1
- 【Language】English
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN ISO 965-5
ISO general purpose metric screw threads - Tolerances - Part 5: Limits of sizes for internal screw threads to mate with hot-dip galvanized external screw threads with maximum size of tolerance position h before galvanizing (ISO 965-5:1998)
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN EN 60191-6-8
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Germa
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN EN 61262-7
Medical electrical equipment - Characteristics of electro-optical X-ray image intensifiers - Part 7: Determination of the modulation transfer function (IEC 61262-7:1995); German version EN 61262-7:1995
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active
- 【Organization】DIN
- 【Document #】DIN EN 62121
Methods of measurement for minidisc recorders/players (IEC 62121:2001); German version EN 62121:2001
- 【Date】2002/5/1
- 【Language】German
- 【Status】Active