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Organization / Document #
IEC
Search Result: About 7216 results.

Breadcrumb

  • 【Organization】IEC
  • 【Document #】IEC 61056-1

  • General purpose lead-acid batteries (valve-regulated types) – Part 1: General requirements, functional characteristics – Methods of test - Edition 3.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 61056-2

  • General purpose lead-acid batteries (valve-regulated types) – Part 2: Dimensions, terminals and marking - Edition 3.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 60432-1

  • Incandescent lamps – Safety specifications – Part 1: Tungsten filament lamps for domestic and similar general lighting purposes - Edition 2.2 Consolidated Reprint

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 61439-3

  • Low-voltage switchgear and controlgear assemblies – Part 3: Distribution boards intended to be operated by ordinary persons (DBO) - Edition 1.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 60601-2-47

  • Medical electrical equipment – Part 2-47: Particular requirements for the basic safety and essential performance of ambulatory electrocardiographic systems - Edition 2.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 80601-2-60

  • Medical electrical equipment – Part 2-60: Particular requirements for the basic safety and essential performance of dental equipment - Edition 1.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 62047-10 CORR 1

  • Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials - Edition 1.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 62047-13

  • Semiconductor devices – Micro-electromechanical devices – Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures - Edition 1.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 62047-14

  • Semiconductor devices – Micro-electromechanical devices – Part 14: Forming limit measuring method of metallic film materials - Edition 1.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active
  • 【Organization】IEC
  • 【Document #】IEC 60352-5

  • Solderless connections – Part 5: Press-in connections – General requirements, test methods and practical guidance - Edition 4.0

  • 【Date】2012/2/1
  • 【Language】English; French
  • 【Status】Active