IEC
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- 【Organization】IEC
- 【Document #】IEC 60728-13
Cable networks for television signals, sound signals and interactive services – Part 13: Optical systems for broadcast signal transmissions - Edition 1.0
- 【Date】2010/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60613
Electrical and loading characteristics of X-ray tube assemblies for medical diagnosis - Edition 3.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60318-4
Electroacoustics – Simulators of human head and ear – Part 4: Occluded-ear simulator for the measurement of earphones coupled to the ear by means of ear inserts - Edition 1.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 61300-2-1 CORR 1
Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-1: Tests – Vibration (sinusoidal) CORRIGENDUM 1 - Edition 3.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 61753-131-3
Fibre optic interconnecting devices and passive components – Performance standard – Part 131-3: Single-mode mechanical fibre splice for category U – Uncontrolled environment - Edition 1.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC TS 62271-304 CORR 1
High-voltage switchgear and controlgear – Part 304: Design classes for indoor enclosed switchgear and controlgear for rated voltages above 1 kV up to and including 52 kV to be used in severe climatic conditions CORRIGENDUM 1 - Edition 1.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60050-112
International Electrotechnical Vocabulary – Part 112: Quantities and units - Edition 1.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60191-6-18
Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) - Edition 1.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 62333-3
Noise suppression sheet for digital devices and equipment – Part 3: Characterization of parameters of noise suppression sheet - Edition 1.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 61191-6
Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method - Edition 1.0
- 【Date】2010/1/1
- 【Language】English; French
- 【Status】Active