IPC
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- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-020D.1 RUSSIAN
Moisture/Reflow Sendistivity Classification for Nonhermetic Solid State Surface Mount Devices
- 【Date】2008/3/1
- 【Language】Russian
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-020D.1 CHINESE
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
- 【Date】2008/3/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-020D.1 CHINESE CD
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
- 【Date】2008/3/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3.2G
Chemical Resistance of Flexible Printed Board Materials
- 【Date】2007/12/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3
Chemical Test Methods - Revision Y
- 【Date】2007/12/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5
Electrical Test Methods - Revision X
- 【Date】2007/12/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-002C CHINESE CD
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Incorporates Amendment 1: October 2008
- 【Date】2007/12/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4563
Resin Coated Copper Foil for Printed Boards Guideline
- 【Date】2007/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4563 CD
Resin Coated Copper Foil for Printed Boards Guideline
- 【Date】2007/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 7711B/7721B CD
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
- 【Date】2007/11/1
- 【Language】English
- 【Status】Active