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Organization / Document #
DIN
Search Result: About 28032 results.

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  • 【Organization】DIN
  • 【Document #】DIN EN 13602

  • Copper and copper alloys - Drawn, round copper wire for the manufacture of electrical conductors

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】DIN EN 13600

  • Copper and copper alloys - Seamless copper tubes for electrical purposes

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】DIN EN 13604

  • Copper and copper alloys - Semiconductor devices, electronic and vacuum products made from high conductivity copper

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】DIN EN 13906-2

  • Cylindrical helical springs made from round wire and bar - Calculation and design - Part 2: Extension springs

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】DIN EN ISO 29022

  • Dentistry - Adhesion - Notched-edge shear bond strength test (ISO 29022:2013)

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】DIN EN ISO 3164

  • Earth-moving machinery - Laboratory evaluations of protective structures - Specifications for deflection-limiting volume (ISO 3164:2013)

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】VG 95370-26/A1

  • Electromagnetic compatibility (EMC) - Electromagnetic compatibility of and in systems - Part 26: Limits for disturbing voltages at receiving antenna terminals; Amendment A1; Text in German and English

  • 【Date】2013/9/1
  • 【Language】English; German
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】VG 95375-60

  • Electromagnetic compatibility (EMC) - Fundamentals and measures for the development and design of systems and equipment - Part 60: Bonding; Text in German and English

  • 【Date】2013/9/1
  • 【Language】English; German
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】DVS 3204

  • Electron beam weldability of metallic materials

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】DIN
  • 【Document #】DIN CEN ISO/TS 25110 被替换成: DIN EN ISO 25110

  • Electronic fee collection - Interface definition for on-board account using integrated circuit card (ICC) (ISO/TS 25110:2013); English version CEN ISO/TS 25110:2013

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active