300/450MM/COPPER/LOW-K CONVERGENCE: TIMING, TRENDS, ISSUES, MARKET ANALYSIS

Chapter 1 Introduction 1-1

Chapter 2 Executive Summary 2-1

2.1 Summary of Technical Issues 2-1
2.2 Summary of Market Forecasts 2-5

Chapter 3 300/450mm Wafer Issues and Trends 3-1

3.1 Introduction 3-1
3.2 Industry Consortia 3-9
3.3 Benefits of 450mm Wafers 3-16
3.4 Requirements For IC Manufacturers 3-23
3.5 Impact on Automation 3-25
3.5.1 Software 3-29
3.6 450mm Wafer Issues 3-31
3.6.1 Overview 3-31
3.6.2 Economic Challenges 3-40

Chapter 4 Copper Issues and Trends 4-1

4.1 Advantages of Copper 4-1
4.2 Copper Processing Challenges 4-7
4.3 Metal Deposition 4-18
4.3.1 Seed Layer 4-18
4.3.2 Bulk Copper Fill 4-21
4.4 Barriers 4-25
4.5 Planarization 4-26
4.6 Metrology 4-30
4.7 Competing against Aluminum Damascene 4-36
4.8 Copper for 22nm 4-38
4.8.1 Low-K and Hard Metal Mask Deposition 4-42
4.8.2 Lithography 4-43
4.8.3 Etch 4-43
4.8.4 Post-etch residue removal 4-45
4.8.5 Chemical mechanical polishing 4-46
4.9 Equipment Suppliers' Copper Electroplating Products 4-48
4.10 Summary 4-56
4.10.1 Advantages/Disadvantages of Cu 4-58
4.10.2 Processing Issues 4-59
4.10.3 Challenges 4-66

Chapter 5 Low-K Dielectric Issues and Trends 5-1

5.1 Introduction 5-1
5.2 Ideal Dielectric 5-2
5.3 Types of Low-K Dielectrics 5-5
5.3.1 FSG 5-5
5.3.2 HSQ 5-7
5.3.3 Nanoporous Silica 5-8
5.3.4 Spin-on Polymers 5-9
5.3.5 BCB 5-17
5.3.6 Flowfill 5-17
5.3.7 CVD 5-18
5.3.8 AF4 5-21
5.3.9 PTFE 5-23
5.4 Processing Issues 5-23
5.5 Summary 5-29
5.5.1 Integration Issues 5-29
5.5.2 Low-K Dielectric Issues 5-30

Chapter 6 Market Analysis 6-1

6.1 Semiconductor Market 6-1
6.2 Road to Recovery 6-3
6.3 Market Forecast Assumptions 6-7
6.4 450mm Wafer Market Forecast 6-8
6.5 300/450mm Equipment Market 6-12
6.5.1 300/450mm Equipment Tools 6-12
6.5.2 Factory Automation in 300mm Fab Market 6-16
6.6 Copper Processing Equipment Market 6-20
6.7 Low-K Dielectric Market 6-29

List of Tables

3.1 Completed Wafer Price Increases With Time And Minimum Page
Feature Sizes 3-19
3.2 Cost of 450mm Fab 3-24
3.3 Generic Model For CZ Crystal Yield 3-36
5.1 Low-K Material Requirements 5-4
5.2 Low-K Materials 5-6
6.1 Worldwide Market Forecast of Si Wafers 6-9
6.2 Worldwide Market Forecast of 300mm Equipment 6-13
6.3 Process Tool Automation For 300mm Fabs 6-17
6.4 Worldwide Forecast of Automation Transfer Tools 6-18
6.5 Worldwide Forecast of Copper Processing Equipment 6-23
6.6 Worldwide Forecast of Low-K Market 6-30

List of Figures

3.1 Increase in Wafer Diameter With Time 3-2
3.2 R&D Costs For Each Wafer Diameter Introduction 3-6
3.3 Fab Costs For Each Wafer Diameter 3-7
3.4 Revenues For Semiconductor and Semiconductor Equipment 3-8
3.5 ITRS Has Its Roadmap For 450mm Wafers 3-10
3.6 450mm Consortia 3-11
3.7 Completed Wafer Price Increases With Time and Minimum Feature Sizes 3-17
3.8 IC Cost With Wafer Size And Device Feature Sizes 3-21
3.9 Trends In Manufacturing Variables In The Transition From 300m To 450mm Wafers 3-22
3.10 Wafer Thickness Trends With Diameter 3-33
3.11 Polysilicon Usage By The Solar Industry 3-38
3.12 Increasing Cost Of Wafer With Time 3-41
4.1 Reduced Complexity of Copper Interconnect 4-4
4.2 Interconnect Delay for Copper 4-6
4.3 ALD Versus PVD Copper Barrier 4-10
4.4 Copper CMP Steps And Challenges 4-14
4.5 Electromigration Resistance 4-17
4.6 Metal Diffusion Barrier 4-27
4.7 Cu Planarization Process 4-28
4.8 Copper ECMD Process 4-31
4.9 Damascus Complete Copper 4-51
4.10 Copper/Low-K Interconnect Schemes 4-53
4.11 Copper And Low-K Integration Concerns 4-67
5.1 Low-K Roadmap 5-3
6.1 300mm Wafer Market As Percentage of Total Market 6-10
6.2 Forecast of 450mm Processing Equipment 6-14
6.3 Interconnect Technology Requirements 6-21
6.3 Electrochemical Deposition Market Shares - Revenues 6-24
6.5 Copper Implementation By Geographic Region 6-26
6.6 Copper Implementation By Feature Size 6-27
6.7 Low-K Deposition Market Shares 6-32
6.8 Low-K Precursor Market 6-34