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Bosch Sensortec BMA355 3-Axis MEMS Accelerometer
2014/07/01
Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!) more CREE CXA1520 LED Array
2014/06/01
CREE’s First High Density LED Array is based on Flip Chip dies. High performance LED array with a luminosity x2 and a cost divided by 4 in 3 years. more Emerging and Innovative Approaches in Photovoltaics
2014/06/01
It’s time to reinforce and reshape R&D efforts to speed-up the PV business. more EnOcean PTM210 - Self-Powered Push Button Transmitter Module
2014/06/01
Using energy harvesting which is in fact like a small dynamo, the PTM210 is more expensive than modules using battery, so what are its advantages ? more Point of Care Testing 2014: Applications for Microfluidic Technologies
2014/06/01
What strategies could new players use to enter the Point of Care market? more Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024
2014/06/01
The Internet of Things (IoT) provides big opportunities for technologies. The device business will reach $46B in 2024, contributing to a total IoT mar.. more Sensonor STIM210 High-precision MEMS Gyro Module
2014/05/01
World highest performance silicon MEMS gyro available without export control. Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 pack.. more Permanent Wafer Bonding for Semiconductor: Application Trends & Technology
2014/05/01
With the SOI business decreasing, the 3D TSV stack beginning, and the competitive environment changing, where will the permanent bonding market go? more Infineon CoolMOS C7 7th generation Superjunction MOSFET
2014/05/01
Infineon has improved the epitaxy process with a direct impact on Rdson, 20% lower more Nanowire LED Patent Investigation
2014/05/01
New nanowire LED startups compete with Asian LED giants in the IP landscape. more