450mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis

 Monthly Update

Chapter 1  Introduction                                                                 1-1

 

Chapter 2  Executive Summary                                                       2-1

 

2.1    Summary of Technical Issues                                                   2-1

2.2     Summary of Market Forecasts                                                   2-5

 

Chapter 3  300mm Wafer Issues and Trends                                   3-1

 

3.1    Introduction                                                                            3-1

3.2    Industry Consortia                                                                    3-9

3.3     Benefits of 450mm Wafers                                                        3-16

3.4     Requirements For IC Manufacturers                                          3-23

3.5     Impact on Automation                                                              3-25

          3.5.1  Software                                                                         3-29

3.6     450mm Wafer Issues                                                                 3-31

          3.6.1  Overview                                                                        3-31

          3.6.2  Economic Challenges                                                      3-40

 

Chapter 4  Copper Issues and Trends                                              4-1

 

4.1    Advantages of Copper                                                              4-1

4.2    Copper Processing Challenges                                                   4-7

4.3     Metal Deposition                                                                      4-18

          4.3.1  Seed Layer                                                                     4-18

          4.3.2  Bulk Copper Fill                                                            4-21

4.4     Barriers                                                                                    4-25

4.5     Planarization                                                                            4-26

4.6     Metrology                                                                                 4-30

4.7     Competing against Aluminum Damascene                                4-36

4.8     Copper for 22nm                                                                       4-38

          4.8.1  Low-K and Hard Metal Mask Deposition                          4-42

4.8.2  Lithography                                                                    4-43

4.8.3  Etch                                                                               4-43

4.8.4  Post-etch residue removal                                                4-45

4.8.5  Chemical mechanical polishing                                       4-46

4.9     Equipment Suppliers' Copper Electroplating Products                4-48

4.10   Summary                                                                                 4-56

          4.10.1 Advantages/Disadvantages of Cu                                   4-58

          4.10.2 Processing Issues                                                           4-59

          4.10.3 Challenges                                                                    4-66

 

Chapter 5  Low-K Dielectric Issues and Trends                               5-1

 

5.1     Introduction                                                                             5-1

5.2     Ideal Dielectric                                                                         5-2

5.3     Types of Low-K Dielectrics                                                       5-5

          5.3.1  FSG                                                                                5-5

          5.3.2  HSQ                                                                               5-7

          5.3.3  Nanoporous Silica                                                           5-8

          5.3.4  Spin-on Polymers                                                            5-9

          5.3.5  BCB                                                                               5-17

          5.3.6  Flowfill                                                                           5-17   5.3.7     CVD     5-18

          5.3.8  AF4                                                                                5-21

          5.3.9  PTFE                                                                              5-23

5.4     Processing Issues                                                                      5-23

5.5     Summary                                                                                 5-29

          5.5.1  Integration Issues                                                            5-29

          5.5.2  Low-K Dielectric Issues                                                   5-30

 

Chapter 6  Market Analysis                                                            6-1

 

6.1     Semiconductor Market                                                              6-1

6.2     Road to Recovery                                                                      6-3

6.3     Market Forecast Assumptions                                                   6-7

6.4     450mm Wafer Market Forecast                                                  6-8

6.5     300/450mm Equipment Market                                                 6-12

          6.5.1  300/450mm Equipment Tools                                          6-12

          6.5.2  Factory Automation in 300mm Fab Market                      6-16

6.6     Copper Processing Equipment Market                                       6-20

6.7     Low-K Dielectric Market                                                           6-29

 

TABLES

 

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3.1     Completed Wafer Price Increases With Time And Minimum

Feature Sizes                                                                           3-19

3.2     Cost of 450mm Fab                                                                  3-24

3.3     Generic Model For CZ Crystal Yield                                          3-36

5.1     Low-K Material Requirements                                                  5-4

5.2     Low-K Materials                                                                       5-6

6.1     Worldwide Market Forecast of Si Wafers                                   6-9

6.2     Worldwide Market Forecast of 300mm Equipment                     6-13

6.3     Process Tool Automation For 300mm Fabs                                6-17

6.4     Worldwide Forecast of Automation Transfer Tools                     6-18

6.5     Worldwide Forecast of Copper Processing Equipment                6-23

6.6     Worldwide Forecast of Low-K Market                                       6-30

 

 

FIGURES

 

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3.1     Increase in Wafer Diameter With Time                                      3-2

3.2     R&D Costs For Each Wafer Diameter Introduction                   3-6

3.3     Fab Costs For Each Wafer Diameter                                          3-7

3.4     Revenues For Semiconductor and Semiconductor Equipment    3-8

3.5     ITRS Has Its Roadmap For 450mm Wafers                                3-10

3.6     450mm Consortia                                                                     3-11

3.7     Completed Wafer Price Increases With Time and Minimum

          Feature Sizes                                                                           3-17

3.8     IC Cost With Wafer Size And Device Feature Sizes                   3-21

3.9     Trends In Manufacturing Variables In The  Transition From

          300m To 450mm Wafers                                                           3-22

3.10   Wafer Thickness Trends With Diameter                                    3-33

3.11   Polysilicon Usage By The Solar Industry                                   3-38

3.12   Increasing Cost Of Wafer With Time                                         3-41

4.1     Reduced Complexity of Copper Interconnect                             4-4

4.2     Interconnect Delay for Copper                                                   4-6

4.3    ALD Versus PVD Copper Barrier                                              4-10

4.4    Copper CMP Steps And Challenges                                           4-14

4.5    Electromigration Resistance                                                      4-17

4.6     Metal Diffusion Barrier                                                             4-27

4.7     Cu Planarization Process                                                           4-28

4.8     Copper ECMD Process                                                              4-31

4.9     Damascus Complete Copper                                                      4-51

4.10   Copper/Low-K Interconnect Schemes                                        4-53

4.11   Copper And Low-K Integration Concerns                                  4-67

5.1     Low-K Roadmap                                                                       5-3

6.1     300mm Wafer Market As Percentage of Total Market                6-10

6.2     Forecast of 450mm Processing Equipment                                 6-14

6.3     Interconnect Technology Requirements                                     6-21

6.3     Electrochemical Deposition Market Shares - Revenues              6-24

6.5     Copper Implementation By Geographic Region                          6-26

6.6     Copper Implementation By Feature Size                                    6-27

6.7     Low-K Deposition Market Shares                                              6-32

6.8     Low-K Precursor Market                                                           6-34