The GaAs IC Markets

 Monthly Update

Chapter 1  Introduction                                                                  1-1

 

Chapter 2  Executive Summary                                                      2-1

 

2.1    Summary of Major Issues                                                         2-1

2.2    Summary of Market Forecast                                                  2-3

 

Chapter 3  Technology Issues                                                          3-1

 

3.1    GaAs Devices                                                                          3-1

          3.1.1 FETs                                                                            3-1

          3.1.2 HEMTs                                                                         3-3

          3.1.3                                                                                       HBT  3-6

3.2  Comparison of Logic Structures                                             3-10

          3.2.1                                                                                       Buffered FET Logic              3-12

          3.2.2                                                                                       FET Logic   3-12

          3.2.3                                                                                       Capacitively Enhanced Logic          3-15

          3.2.4                                                                                       Direct-Coupled FET Logic             3-15

          3.2.5                                                                                       Source-Coupled FET Logic             3-17

3.3    Material Issues                                                                      3-20

          3.3.1 Wafer Production                                                         3-20

          3.3.2 Etch Pit Densities                                                        3-25

3.4    Equipment                                                                               3-29

          3.4.1                                                                                       Implanters     3-42

          3.4.2                                                                                       Lithography   3-43

          3.4.3                                                                                       Etching    3-44

          3.4.4                                                                                       Deposition     3-46

          3.4.5  Rapid Thermal Processing                                               3-46

3.5    Packaging                                                                                 3-47

          3.5.1                                                                                       Package Types          3-48

          3.5.2                                                                                       Bonding   3-50

3.6    Testing                                                                                   3-55

3.7  Design                                                                                   3-56

 

Chapter 4  Applications for GaAs ICs                                             4-1

 

4.1     Introduction                                                                             4-1

          4.1.1  The Trend Toward Higher Frequencies                             4-3

          4.1.2  Transition from Analog to Digital Modulation                 4-3

          4.1.3  Discrete Components and Silicon-Based ICs                    4-4

4.2     Markets                                                                                    4-7

          4.2.1  Telecommunications Systems                                          4-7

          4.2.2  Television Systems                                                          4-13

          4.2.3  Computing                                                                     4-14

          4.2.4  Data Communications                                                     4-15

          4.2.5  Automotive                                                                    4-20

          4.2.6  Automated Test Equipment                                             4-22

          4.2.7  Military                                                                          4-23

 

Chapter 5  IC Supplier and End-User Issues                                   5-1

 

5.1  Introduction                                                                            5-1

5.2    Competing Against Silicon                                                       5-3

5.3    Competing Against The Japanese                                           5-11

5.4     Taiwan’s Market Momentum                                                    5-11

5.5     Korea’s Market Momentum                                                      5-13

5.6     Wafer Sizes                                                                              5-19

5.7     Competing Against SiGe                                                           5-22

5.7.1  Introduction                                                                    5-22

5.7.2  Technology                                                                     5-25

          5.7.2.1  Strained Silicon                                                 5-26

          5.7.2.2  Device Manufacturing                                       5-36

5.7.3  Applications                                                                    5-38

          5.7.3.1  Wireless LAN                                                    5-38

          5.7.3.2  WiMAX                                                            5-38

          5.7.3.3  Bluetooth                                                          5-39

          5.7.3.4  Cellular                                                             5-39

          5.7.3.5  GPS                                                                  5-52

Chapter 6  Market Forecast                                                             6-1

 

6.1    Driving Forces                                                                          6-1

6.2    Market Forecast Assumptions                                                  6-5  

6.3  GaAs IC Market Forecast                                                          6-7

6.4  SiGe IC Market Forecast                                                           6-22

6.5     End Application Market                                                            6-25

 

Chapter 7  Profile of GaAs IC Manufacturers                                7-1

 

 

LIST OF TABLES

 

                                                                                                      Page

5.1     Cost Comparison for GaAs Structures                                       5-8

5.2     A Comparison of SiGe BiCMOS, RF CMOS, and InGaP/GaAs   5-37

6.1     Worldwide Merchant GaAs IC Market Forecast By Device Type 6-8

6.2     Worldwide Merchant Market Forecast By Geographical Region  6-11

6.3     Worldwide Merchant Market Forecast By Application             6-13

6.4     Market Shares of Merchant Participants - 2012                         6-21

 

 

LIST OF FIGURES

 

                                                                                                      Page

3.1     Schematic of GaAs MESFET                                                  3-2

3.2     Schematic of GaAs HEMT Device                                          3-4

3.3     Schematic of GaAs HBT Device                                             3-8

3.4     Schematic of GaAs HBT Device                                             3-9

3.5     Symbolic Representations of Various GaAs Transistor Type       3-11

3.6     Schematic of BFL Logic Gate                                                   3-13

3.7     Schematic of FETL Logic Gate                                              3-14

3.8     Schematic of CEL Logic Gate                                                   3-16

3.9     Schematic of DCFL Logic Gate                                              3-18

3.10   Schematic of SCFL Logic Gate                                              3-19

3.11   Full wafer EPD mapping of LEC and VGF wafers                      3-27

3.12   Mesoscopic EL2 mapping of LEC and VGF wafers                     3-28

3.13   pHEMT MMIC Process Flow Chart                                           3-31

3.14 0.15 Micron 3MI Process Cross Section                                     3-37

3.15 InGaP HBT Process                                                                  3-40

5.1     Comparison of Die Costs of Si and GaAs                                   5-6

5.2     Strained Silicon Germanium Technology                                   5-28

5.3     Fourth Generation Of Strain Technology                                   5-32

5.4     Performance Versus Germanium Content                                  5-33

5.5    Bulk Versus SOI Strain Method                                                5-34

6.1     Worldwide Merchant GaAs IC Market Forecast                          6-9

6.2     Worldwide GaAs Merchant Market Forecast By

          Geographical Region                                                                 6-12

6.3     Worldwide GaAs Merchant Market Forecast By Application   6-14

6.4     Global Handset Market                                                             6-16

6.5     Migration Of PA’s In Handset Market                                       6-18

6.6     CMOS Replacement Of Bipolar And GaAs                                6-19

6.7     Worldwide SiGe Market Forecast                                               6-23