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Metrology, Inspection, and Process Control in VLSI Manufacturing
出 版 商：The Information Network
出版日期：2014/12/02
TABLE OF CONTENTS
Page
Chapter 1 Introduction 1-1
Chapter 2 Executive Summary 2-1
Chapter 3 Metrology/Inspection Technologies 3-1
3.1 Introduction 3-1
3.2 Imaging Techniques 3-5
3.2.1 Scanning Electron Microscope (SEM) 3-6
3.2.2 Transmission Electron Microscope (TEM) 3-7
3.3 Scanning Probe Microscopes 3-10
3.3.1 Atomic Force Microscopy (AFM) 3-10
3.3.2 Scanning Tunneling Microscopy (STM) 3-16
3.3.3 Scanning Probe Microscopy (SPM) 3-18
3.3.4 AFM Types 3-20
3.3.4.1 Contact AFM 3-22
3.3.4.2 Dynamic Force Mode AFM Techniques 3-25
3.3.5 Scanning Surface Potential Microscopy (SSPM) 3-28
3.4 Optical Techniques 3-30
3.4.1 Scatterometry 3-31
3.4.1.1 Ellipsometry 3-33
3.4.1.2 Reflectometry 3-40
3.4.1.3 Scatterometry Developments 3-42
3.4.2 Total Reflection X-Ray Fluorescence (TXRF) 3-44
3.4.3 Energy Dispersive X-Ray Analysis (EDX) 3-47
3.4.4 Secondary Ion Mass Spectrometry (SIMS) 3-48
3.4.4.1 Surface Imaging Using SIMS 3-50
3.4.4.2 SIMS Depth Profiling 3-50
3.4.5 Auger Electron Spectroscopy 3-52
3.4.6 Focused Ion Beam (FIB) 3-57
3.4.7 X-Ray Reflectometry (XRR) 3-61
3.4.8 X-Ray Photoelectron Spectroscopy (XPS) 3-63
3.4.9 Rutherford Backscattering (RBS) 3-65
3.4.10 Optical Acoustics Metrology 3-67
3.4.11 Fourier Transform Infrared Spectroscopy (FTIR) 3-69
3.4.12 Thermally-Induced Voltage Alteration (TIVA) 3-70
3.5 Film Thickness And Roughness 3-71
3.5.1 Surface Inspection Technology 3-71
3.5.2 Dimensional Technology 3-74
3.5.3 Stylus Profilometer 3-76
Chapter 4 Defect Review/Wafer Inspection 4-1
4.1 Introduction 4-1
4.2 Defect Review 4-2
4.2.1 SEM Defect Review 4-3
4.2.2 Optical Defect Review 4-7
4.2.3 Other Defect Review 4-8
4.3 Patterned Wafer Inspection 4-9
4.3.1 E-Beam Patterned Wafer Inspection 4-10
4.3.2 Optical Patterned Wafer Inspection 4-12
4.4 Unpatterned Wafer Inspection 4-18
4.5 Macro-Defect Inspection 4-21
Chapter 5 Thin Film Metrology
5.1 Introduction 5-1
5.1.1 Front End Applications 5-1
5.1.2 Back End Applications 5-2
5.2 Metal Thin-Film Metrology 5-3
5.3 Non-Metal Thin-Film Metrology 5-10
5.4 Substrate/Other Thin Film Metrology 5-25
Chapter 6 Lithography Metrology 6-1
6.1 Overlay 6-1
6.2 CD 6-6
6.3 Mask (Reticle) Metrology/Inspection 6-20
Chapter 7 Market Forecast 7-1
7.1 Introduction 7-1
7.2 Market Forecast Assumptions 7-3
7.3 Market Forecast 7-4
7.3.1 Total Process Control Market Forecast 7-4
7.3.2 Lithography Metrology Market Forecast 7-10
7.3.2.1 Overlay Market Forecast 7-13
7.3.2.2 CD Measurement Market Forecast 7-16
7.3.2.3 Mask Inspection Market Forecast 7-19
7.3.2.4 Mask Metrology Market Forecast 7-22
7.3.3 Wafer Inspection / Defect Review Market 7-25
7.3.3.1 Patterned Wafer Inspection Market Forecast 7-28
o E-Beam Patterned Wafer Inspection Market
Forecast 7-31
o Optical Patterned Wafer Inspection Market
Forecast 7-34
7.3.3.2 Defect Review Market Forecast 7-37
o SEM Defect Review Market Forecast 7-40
o Optical Defect Review Market Forecast 7-43
o Other Defect Review Market Forecast 7-46
7.3.3.3 Unpatterned Wafer Inspection Market Forecast 7-49
7.3.3.4 Macro Defect Detection Market Forecast 7-52
7.3.4 Thin Film Metrology Market Forecast 7-55
7.3.4.1 Non-Metal Thin Film Metrology Market Forecast 7-58
o Non-Metal Standalone Thin Film Metrology
Market Forecast 7-62
o Non-Metal Integrated Thin Film Metrology
Market Forecast 7-64
7.3.4.2 Substrate / Other Thin Film Metrology Market
Forecast 7-67
7.3.5 Other Process Control Systems Market Forecast 7-70
Chapter 8 Integrated/In-Situ Metrology/Inspection Trends 8-1
8.1 Introduction 8-1
8.2 In-Situ Metrology 8-1
8.3 Integrated Metrology 8-6
8.3.1 Benefits 8-11
8.3.2 Limitations 8-13
Chapter 9 Key Drivers 9-1
9.1 300mm/450mm Wafers 9-1
9.2 Copper Metrology 9-3
9.3 Low-K Dielectrics 9-6
9.4 Chemical Mechanical Planarization (CMP) 9-9
9.5 Ion Implant 9-19
LIST OF TABLES
Page
3.1 Comparison Of Derivative AFM Techniques 3-19
5.1 Comparison Of White-Light With Multiple-Angle Laser
Ellipsometry 5-16
7.1 Total Process Control Market Forecast 7-5
7.2 Lithography Metrology Market Forecast 7-11
7.3 Overlay Market Forecast 7-14
7.4 CD Measurement Market Forecast 7-17
7.5 Mask Inspection Market Forecast 7-20
7.6 Mask Metrology Market Forecast 7-23
7.7 Wafer Inspection / Defect Review Market Forecast 7-26
7.8 Patterned Wafer Inspection Market Forecast 7-29
7.9 E-Beam Patterned Wafer Inspection Market Forecast 7-32
7.10 Optical Patterned Wafer Inspection Market Forecast 7-35
7.11 Defect Review Market Forecast 7-38
7.12 SEM Defect Review Market Forecast 7-41
7.13 Optical Defect Review Market Forecast 7-44
7.14 Other Defect Review Market Forecast 7-47
7.15 Unpatterned Wafer Inspection Market Forecast 7-50
7.16 Macro Defect Detection Market Forecast 7-53
7.17 Thin Film Metrology Market Forecast 7-56
7.18 Non-Metal Thin Film Metrology Market Forecast 7-59
7.19 Non-Metal Standalone Thin Film Metrology Market Forecast 7-62
7.20 Non-Metal Integrated Thin Film Metrology Market Forecast 7-65
7.21 Substrate / Other Thin Film Metrology Market Forecast 7-68
7.22 Other Process Control Systems Market Forecast 7-71
9.1 Dielectric Film Challenges 9-8
LIST OF FIGURES
Page
3.1 Schematic Of Scanning Electron Microscope 3-8
3.2 Schematic Of Transmission Electron Microscope 3-11
3.3 Schematic Of Atomic Force Microscopy 3-12
3.4 Schematic Of Scanning Tunneling Microscopy 3-17
3.5 Interaction Between Two Atoms In AFM 3-21
3.6 Schematic Of Lateral Force Microscopy 3-24
3.7 Schematic Of Dynamic Force Mode AFM 3-26
3.8 Schematic Of Scanning Surface Potential Microscopy 3-29
3.9 Principle Of Scatterometry 3-32
3.10 Schematic Of Ellipsometer 3-34
3.11 Principles Of CD Scatterometry 3-43
3.12 Conventional TXRF Analysis Geometry 3-45
3.13 Schematic Of Secondary Ion Mass Spectrometry 3-49
3.14 Principle Of Auger Electron Emission 3-53
3.15 Schematic Of Auger Electron Spectroscopy 3-54
3.16 Schematic Of Focused Ion Beam Technology 3-58
3.17 Schematic Of X-Ray Reflectometry 3-62
3.18 Schematic Of X-Ray Photoelectron Spectroscopy 3-64
3.19 Schematic Of Rutherford Backscattering 3-66
3.20 Schematic Of Optical Acoustics Metrology 3-68
3.21 Spatial Wavelength Of Nanotopography 3-72
3.22 Schematic Of Non-Contact Capacitive Gauging 3-75
3.23 Schematic Of Stylus Profilometer 3-77
5.1 Spectroscopic Ellipsometry Diagram 5-17
6.1 ITRS Overlay Technology Roadmap 6-3
6.2 Illustration Of 3D Structure 6-9
6.3 ITRS Metrology Roadmap 6-15
6.4 Schematic Of OCD Optics 6-19
7.1 Total Process Control Market Forecast 7-6
7.2 Total Process Control Market By Geographic Region 7-8
7.3 Total Process Control Market Vs. Overall Equipment
Market 7-9
7.4 Lithography Metrology Market Shares 7-12
7.5 Overlay Market Shares 7-15
7.6 CD Measurement Market Shares 7-18
7.7 Mask Inspection Market Shares 7-21
7.8 Mask Metrology Market Shares 7-24
7.9 Wafer Inspection / Defect Review Market Shares 7-27
7.10 Patterned Wafer Inspection Market Shares 7-30
7.11 E-Beam Patterned Wafer Inspection Market Shares 7-33
7.12 Optical Patterned Wafer Inspection Market Shares 7-36
7.13 Defect Review Market Shares 7-39
7.14 SEM Defect Review Market Shares 7-42
7.15 Optical Defect Review Market Shares 7-45
7.16 Other Defect Review Market Shares 7-48
7.17 Unpatterned Wafer Inspection Market Shares 7-51
7.18 Macro Defect Detection Market Shares 7-54
7.19 Thin Film Metrology Market Shares 7-57
7.20 Non-Metal Thin Film Metrology Market Shares 7-60
7.21 Non-Metal Standalone Thin Film Metrology
Market Shares 7-63
7.22 Non-Metal Integrated Thin Film Metrology Market Shares 7-66
7.23 Substrate / Other Thin Film Metrology Market Shares 7-69
7.24 Other Process Control Systems Market Shares 7-72
7.25 Other Process Software Market Shares 7-73
8.1 Integrated Control In A Fab 8-7
9.1 Polish Endpoint Control 9-17
