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Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies
Chapter Introduction 1-1
Chapter 2 Niche Markets for PROCESSES for 300mm Wafers 2-1
2.1 Introduction 2-1
2.2 Wafer Level Processing (WLP) 2-3
2.2.1 Introduction 2-3
2.2.2 Flip Chip/WLP Processing Issues and Trends 2-4
o Wafer Bumping 2-4
o Wafer Level Packaging 2-8
o Pad Redistribution 2-12
o Wafer Bumping Costs 2-18
2.2.3 Lithography Issues And Trends 2-20
2.2.4 UBM Etch Issues And Trends 2-21
2.2.5 Metallization Issues and Trends 2-25
o Gold Bumping Metallization 2-25
o Solder Bumping Metallization 2-27
2.2.6 Analysis of WLP Market 2-29
2.3 3-D TSV 2-32
2.3.1 Insight Into Critical Issues 2-32
2.3.2 Cost Structure 2-33
2.3.3 Critical Processing Technologies 2-40
2.3.4 Evaluation Of Critical Development Segments 2-46
2.3.5 TSV Device Forecast 2-52
2.4 Non-volatile Memory Devices MRAM, RRAM and FeRAM 2-55
2.4.1 Processing Requirements for MRAMs 2-60
2.4.2 Processing Requirements for RRAMs 2-63
2.4.3 Processing Requirements for FeRAMs 2-66
2.4.4 Roadmap for Commercialization 2-68
2.5 Ultrathin Wafers 2-71
2.5.1 Applications for Ultrathin Wafers 2-71
2.5.2 Substrate Thinning 2-72
2.5.3 Backside Metallization Requirements 2-79
2.5.4 Surface Stress Relief 2-81
2.5.5 Ultrathin Wafer Market 2-83
Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm
Wafers 3-1
3.1 Introduction 3-1
3.2 MEMs 3-3
3.2.1 The MEMS Market Infrastructure 3-3
3.2.2 Forecast Of The Key Applications And Markets 3-5
o MEMS Device Market Forecast 3-5
o MEMS System Market Forecast 3-17
3.2.3 Markets for Equipment and Materials Suppliers 3-20
3.3 HB-LEDs 3-40
3.3.1 Recent Progress in High Brightness LED Technology and
Applications 3-40
3.3.2 Processing Equipment 3-49
3.3.3 Materials of Construction 3-61
3.3.4 OLED Manufacturing 3-65
3.3.5 Outlook for the Worldwide OLED Market 3-68
3.3.6 Outlook for the Worldwide HB-LED Market 3-72
3.4 Compound Semiconductors 3-83
3.4.1 GaAs Devices 3-83
3.4.2 Equipment Trends 3-92
3.4.3 Wafer Sizes 3-104
3.4.4 GaAs IC Market Forecast 3-107
3.4.5 Competing Against SiGe 3-109
3.5 Thin Film Read/Write Heads for HDD 3-117
3.5.1 Trends in HDDs 3-117
3.5.2 Recording Head Market Forecast 3-126
3.5.3 Head Processing 3-129
3.5.4 Head Fabrication – CMP, Deposition, Lithography 3-134
3.5.5 CMP Challenges 3-139
3.5.6 Lithography Challenges 3-145
3.6 Bulk Acoustic Wave (BAW) 3-148
3.6.1 Basic Elements of the BAW Device 3-150
3.6.2 AlN Layer Quality Requirements 3-153
3.6.3 Equipment Requirements for BAW and FBAR Filtering
Devices 3-157
3.6.4 Bulk Acoustic Wave (BAW) Market 3-158
TABLES
Page
2.1 Common UBM Stacks For Solder And Gold Bumping 2-5
2.2 Solder Bumping Guidelines 2-7
2.3 ITRS Pin Counts For Different Applications 2-9
2.4 Pillar-WLP CSP Guidelines 2-14
2.5 Pad Redistribution Guidelines 2-17
2.6 UBM Film Etchants 2-24
2.7 Common UBM Stacks For Gold And Solder Bumping 2-26
2.8 WLP Demand By Device (Units) 2-30
2.9 WLP Demand By Device (Wafers) 2-31
2.10 Forecast Of TSV Devices By Wafers 2-53
3.1 MEMS Device Markets 3-6
3.2 MEMS System Markets 3-19
3.3 MEMS Equipment Markets 3-21
3.4 Color, Wavelength Material Of LED 3-42
3.5 Comparison of LED, HB-LED, UHB-LED Characteristics 3-48
3.6 Epitaxy Metrics from Initial Solid-State Lighting
Manufacturing R&D Roadmap 3-55
3.7 Process Control Metrics 3-57
3.8 Production Method for Various LEDs 3-62
3.9 GaAs IC Market Forecast 3-108
3.10 Comparison Of Piezoelectric Materials For BAW Applications 3-154
FIGURES
Page
2.1 Solder Bumping Process 2-6
2.2 Pillar-WLPCSP Process 2-13
2.3 Pad Redistribution Process 2-16
2.4 Via First (iTSV) Cost Of Ownership 2-34
2.5 Via First (iTSV) Cost Of Ownership Front And Back Side 2-36
2.6 Via First (iTSV) Process Flow 2-37
2.7 iTSV Versus pTSV Cost Of Ownership 2-38
2.8 Effect Of TSV Depth And Diameter On Cost 2-39
2.9 Illustration Of Bosch Process 2-43
2.10 Process And Equipment Flow For EMC3D Consortium Members 2-47
2.11 Various TSV Integration Schemes 2-49
2.12 Forecast OF TSV Devices By Wafers 2-54
2.13 Comparison Of Non-Volatile RAM Write Times 2-56
2.14 Competition In Dissipation Speed And Memory Capacity 2-57
2.15 Comparison Of MTAM Technologies 2-62
2.16 Tunneling Magnetoresistive (TMR) Device For MRAM 2-64
2.17 Al / TiOx / Al ”Sandwich Of An RRAM 2-65
2.18 Different FeERAM Cell Designs 2-67
2.19 Wafer Thinning Equipment Sales Forecast 2010-2015 2-84
3.1 Operation of LED 3-41
3.2 Market drivers for LED Biz and Applications 3-45
3.3 SSL vs. Classical Technologies 3-46
3.4 LED Performance vs. Traditional Light Sources 3-47
3.5 Pareto Analysis Of SSL Manufacturing Costs 3-52
3.6 Nanoimprint Lithography System 3-60
3.7 Regular LED (white) Front-End Steps 3-63
3.8 Schematic of AMOLED 3-69
3.9 Active Matrix OLED Demand Forecast 3-70
3.10 LED Market by Sector 3-81
3.11 Worldwide LED Market Forecast 3-82
3.12 Schematic of GaAs MESFET 3-84
3.13 Schematic of GaAs HEMT Device 3-86
3.14 Schematic of GaAs HBT Device 3-89
3.15 Schematic of GaAs HBT Device 3-91
3.16 pHEMT MMIC Process Flow Chart 3-93
3.17 0.15 Micron 3MI Process Cross Section 3-99
3.18 InGaP HBT Process 3-102
3.19 Worldwide SiGe Market Forecast 3-115
3.21 Decrease In Average Price Of Storage 3-119
3.22 Heads Per Drive -- 2003-2014 3-121
3.23 Increase In Areal Density 3-123
3.24 Market Forecast Of Recording Head Consumption 3-127
3.25 Heads Per Drive Forecast 3-128
3.26 Thin Film Head Structure 3-130
3.27 Critical Features In Thin Film Head Structure 3-131
3.28 Spin Valve Head Structure 3-132
3.29 Cross-Sectional View TFH Stacks 3-135
3.30 Cross-Sectional View Of A TFH Design 3-136
3.31 CMP Slurry System For Tfh Wafer Polishing 3-143
3.32 Critical Feature Trends In Thin Film Heads 3-146
3.33 Application Space For Rf Filters 3-149
3.34 FBAR Diagram 3-151
3.35 BAW-SMR Diagram 3-152
3.36 Worldwide BAW Forecast 3-159
