Plasma Etching: Market Analysis and Strategic Issues

Chapter 1   Introduction                                                                   1-1

 

1.1    The Need For This Report                                                        1-1

 

Chapter 2   Executive Summary                                                       2-1

 

2.1    Summary of Technical Issues                                                   2-1

2.2    Summary of User Issues                                                           2-2

2.3    Summary of Supplier Issues                                                     2-3

2.4     Summary of Market Forecasts                                                   2-4

 

Chapter 3 Technical Issues and Trends                                             3-1

 

3.1    Introduction                                                                            3-1

3.2    Processing Issues                                                                     3-14

          3.2.1 Chlorine Versus Fluorine Processes                                 3-19

          3.2.2 Multilevel Structures                                                      3-32

          3.2.3 New Materials                                                                3-42

          3.2.4 GaAs Processing                                                             3-50

3.3     Plasma Stripping                                                                       3-51

          3.3.1  Photoresist Stripping                                                       3-51

          3.3.2  Low-K Removal                                                              3-72

3.4    Safety Issues                                                                            3-73

          3.4.1 System Design Considerations                                        3-73

          3.4.2 Gas Handling                                                                 3-74

          3.4.3 Reactor Cleaning                                                            3-76

 

 

 

                  

Chapter 4   Market Forecast                                                             4-1

 

4.1    Influence of Technology Trends on the Equipment Market       4-1

4.2    Market Forecast Assumptions                                                   4-5

4.3    Market Forecast                                                                        4-6

 

Chapter 5   Strategic Issues: Users                                                    5-1

 

5.1    Evaluating User Needs                                                             5-1

          5.1.1 Device Architecture                                                        5-1

          5.1.2 Wafer Starts and Throughput Requirements                     5-5

          5.1.3 Wafer Size                                                                     5-6

5.2    Benchmarking a Vendor                                                           5-7

          5.2.1 Pricing                                                                           5-7

          5.2.2 Vendor Commitment and Attitudes                                5-9

          5.2.3 Vendor Capabilities                                                        5-10

          5.2.4 System Capabilities                                                        5-12

5.3    Cost Analysis                                                                           5-14

          5.3.1 Equipment Price                                                             5-14

          5.3.2 Installation Costs                                                           5-17

          5.3.3 Maintenance Costs                                                         5-18

          5.3.4 Sustaining Costs                                                            5-19

          5.3.5 Hidden Costs                                                                  5-19

5.4    User - Supplier Synergy                                                            5-20

          5.4.1 Feedback During Equipment Evaluation                         5-20

          5.4.2 Feedback During Device Production                                5-21

 

 

 

 

 

 

 

 

Chapter 6   Strategic Issues: Suppliers                                              6-1

 

6.1    Competition                                                                            6-1

6.2    Customer Interaction                                                               6-3

          6.2.1 Customer Support                                                          6-3

          6.2.2                                                                                       Cleanroom Needs in the Applications Lab                                                                               6-6

6.3    Equipment Compatibility in Class 1 Cleanrooms                       6-7

          6.3.1 Footprint Versus Serviceability                                       6-7

          6.3.2 Particulate Generation                                                    6-7

          6.3.3 Automation                                                                   6-17

6.3.4 300-mm Tools                                                                 6-20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

FIGURES

 

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3.1     Various Enhanced Designs (a) Helicon, (b) Multiple

          ECR, (c) Helical Resonator                                                        3-4

3.2     Schematic of Inductively Coupled Plasma Source                      3-6

3.3     Schematic of the HRe Source                                                    3-9

3.4     Schematic of the Dipole Magnet Source                                    3-10

3.5     Schematic of Chemical Downstream Etch                                 3-11

3.6    Silicon Trench Structure                                                         3-21

3.7     fin/STI Etch Requirements                                                        3-34

3.8     FinFET Gate Etch Requirements                                               3-36

3.9     Dual Damascene Dielectric Etch Approaches                             3-38

4.1    Trends in Minimum Feature Size for Dynamic RAMS               4-4

4.2    Market Shares for Dry Etch Equipment                                     4-7

4.3    Market Shares for Strip Equipment                                            4-10

4.4     Distribution of Etch Sales by Type                                            4-14

4.5     Distribution of Etch Sales by Device                                         4-16

4.6    Geographical Distribution of Equipment Purchases                    4-18

5.1    Typical First Year Single Wafer System Cost Analysis               5-16

6.1     Relationship Between Device Yield and Particles                       6-9

6.2     Sources of Particles                                                                   6-12

6.3     Relationship Between Die Yield and Chip Size                          6-16

 

 

 

 

 

 

 

 

 

 

 

TABLES

 

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3.1    Silicon Wafer Usage                                                                  3-2

3.2     Plasma Source Comparison                                                       3-12

3.3     Typical Process Specifications                                                   3-18

4.1     Worldwide Dry Etch Market Shares                                           4-8

4.2     Worldwide Dry Strip Market Shares                                           4-11

4.3    Worldwide Market Forecast of Plasma Etching Systems             4-12

4.4     Distribution of Etch Sales by Device by Vendor                         4-15

4.5     Number of Layers To Be Etched                                                4-19

5.1     Levels of Integration of Dynamic Rams                                     5-3

5.2     Interconnect Levels of Logic Devices                                        5-4

6.1     Etch Process Specifications    6-