Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

 Monthly Update

Chapter 1  Introduction                                                                 1-1

 

Chapter 2  Executive Summary                                                       2-1

 

Chapter 3  Flip Chip/WLP Issues and Trends                                 3-1

 

3.1    Introduction                                                                            3-1

3.2     Wafer Bumping                                                                        3-6

          3.2.1  Solder Bumps                                                                 3-7

                   3.2.1.1  Metallurgy                                                        3-7

                   3.2.1.2  Deposition Of UBM                                          3-11

                   3.2.1.3  Sputter Etching                                                 3-12

                   3.2.1.4  Photolithography                                               3-13

                   3.2.1.5  Solder Deposition                                              3-14

                   3.2.1.6  Resist Strip                                                       3-15

                   3.2.1.7  UBM Wet Etch                                                 3-16

                   3.2.1.8  Reflow                                                              3-16

                   3.2.1.9  Flux Issues                                                        3-18

          3.2.2  Gold Bumps                                                                    3-19

                   3.2.2.1  Bump Processing                                               3-19

                   3.2.2.2  Bonding                                                            3-21

                   3.2.2.3  Coplanarity                                                      3-25

                   3.2.2.4  Conductivity                                                    3-26

                   3.2.2.5  Thermal Properties                                           3-26

                   3.2.2.6  Size                                                                  3-27

                   3.2.2.7  Reliability                                                        3-27

                   3.2.2.8  Cost Issues                                                        3-28

          3.2.3  Copper Pillar Bumps                                                       3-31

          3.2.4  Copper Stud Bumping                                                     3-35

          3.2.5  C4NP                                                                            3-40

3.3     Wafer Level Packaging                                                             3-46

3.4     Pad Redistribution                                                                    3-53

3.5     Wafer Bumping Costs                                                              3-57

          3.5.1  Wafer Redistribution And Wafer Bumping Costs             3-58

          3.5.2  WLCSP Hidden Costs                                                     3-59

          3.5.3  WLCSP Cost Per Good Die                                              3-60

          3.5.4  Wafer-Level Underfill Costs                                            3-61

 

Chapter 4  Lithography Issues And Trends                                     4-1

 

4.1     Issues                                                                                       4-1

          4.1.1  Technical Performance                                                   4-2

          4.1.2  Capital Investment                                                          4-2

          4.1.3  Cost Of Consumables                                                     4-2

          4.1.4  Throughput                                                                    4-2

          4.1.5  Ease Of Use                                                                   4-3

          4.1.6  Flexibility                                                                      4-3

          4.1.7  Equipment Support                                                         4-3

          4.1.8  Resolution                                                                      4-3

          4.1.9  Solder Bumping Capabilities                                            4-4

          4.1.10 Gold Bumping Capabilities                                              4-5

4.2     Exposure Systems                                                                    4-6

          4.2.1  Introduction                                                                    4-6

                   4.2.1.1  Reduction Steppers                                            4.6

                   4.2.1.2  Full-Field Projection                                          4-8

                   4.2.1.3  Mask Aligners                                                   4-13

                   4.2.1.4  1X Steppers                                                       4-13

4.3     Competitive Technologies                                                         4-16

          4.3.1  Inkjet Printing                                                                4-16

          4.3.2  Stencil/Screen Printing                                                    4-18

          4.3.3  Electroless Metal Deposition                                            4-22

 

 

 

 

Chapter 5  UBM Etch Issues And Trends                                        5-1

 

5.1     Introduction                                                                             5-1

5.2     Technology Issues And Trends                                                  5-2

5.2.1  Process Flow                                                                   5-2

5.2.2  Etch Process                                                                   5-4

5.2.3  Etch Chemistry                                                               5-8

5.3  Batch Versus Single-Wafer Etching                                            5-16

 

Chapter 6  Metallization Issues and Trends                                     6-1

 

6.1  Introduction                                                                               6-1

6.2 Sputtering Metallization                                                               6-3

          6.2.1  Gold Bump                                                                    6-3

          6.2.2  Solder Bumping                                                             6-4

                   6.2.2.1  T i / Cu and TiW / Cu                                        6-5

                   6.2.2.2  Al / NiV / Cu                                                    6-5

                   6.2.2.3  T i / N i (V) and TiW / Ni ( V )                          6-6

                   6.2.2.4  Cr / Cr-Cu / Cu                                                 6-6

 

Chapter 7  Market Analysis                                                            7-1

 

7.1     Market Drivers For Flip Chip And WLP                                     7-1

7.1.1  WLP For Small Die                                                         7-2

7.1.2  WLP For Medium Die                                                     7-2

7.1.3  WLP For Large Die                                                         7-3

7.2     Market Opportunities                                                                7-5

7.3     Challenges                                                                                7-9

7.4     Flip Chip Market                                                                      7-12

          7.4.1  Market Dynamics                                                            7-12

          7.4.2  Market Forecast                                                              7-20

7.5     Lithography Market                                                                  7-26

7.5.1  Aligners Vs. Steppers                                                      7-26

7.5.2  Market Analysis                                                              7-27

7.6     Wet Etch Market                                                                      7-32

7.7     Deposition Market                                                                    7-37

TABLES

 

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3.1     Common UBM Stacks For Solder And Gold Bumping               3-8

3.2     Solder Bumping Guidelines                                                       2-10

3.3     Gold Bumping Guidelines                                                         3-24

3.4     Copper Bumping Guidelines                                                     3-34

3.5     Comparison Of Solder Bumping Processes                                 3-43

4.1     Key Challenges For WLP Lithography                                       4-12

4.2     Lithography Tools By Vendor                                                   4-15

5.1     UBM Film Etchants                                                                  5-10

5.2     Advantages Of Spin Processing                                                 5-19

6.1     Common UBM Stacks For Gold And Solder Bumping               6-2

7.1     WLP Demand by Device (Units)                                               7-24

7.2     WLP Demand by Device (Wafers)                                             7-25

7.3     Comparison Of Mask Aligners Versus Steppers                          7-28

7.4     Worldwide Lithography Forecast                                               7-29

7.5     Worldwide Forecast For UBM Etch Tools                                  7-34

7.6     Worldwide Forecast For UBM Etchants                                     7-36

7.7     Worldwide Forecast For Deposition Tools                                  7-38

 

 

 

 

 

 

 

 

 

 

 

FIGURES

 

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3.1     C4 Chip Connections                                                                3-3

3.2     Wafer Bump Technology Roadmap                                           3-4

3.3     Comparison Of Copper Pillar, Flip Chip, And WLP                    3-5

3.4     Solder Bumping Process                                                            3-9

3.5     Three Process Flows For Solder Bumping                                  3-17

3.6     Gold Bumping Process                                                              3-23

3.7     Cost Per Gold Bumped Wafer                                                    3-29

3.8     Copper Stud Bump                                                                   3-36

3.9     Breakdown Of Stud Bumping Costs                                          3-39

3.10   C4NP Process Description                                                         3-41

3.11   Pillar-WLPCSP Process                                                             3-51

3.12   Pad Redistribution Process                                                        3-54

4.1     Laser-Projection Imaging                                                          4-10

4.2     Solder Jet Technology                                                               4-17

4.3     Principle Of Screen  Printing                                                   4-20

4.4     Principle Of Inkjet Printing                                                       4-21

4.5     Electroless Under Bump Metallization                                       4-23

5.1     Electroplated Solder Bumping Process                                       5-3

7.1     WLP Applications By Die Size                                                  7-4

7.2     WLP Applications                                                                     7-6

7.3     Flip Chip Market - 2012                                                            7-21

7.4     Flip Chip Market - 2017                                                            7-22

7.5     Historic Lithography Market Shares                                          7-30

7.6     Lithography Market Shares                                                       7-31

7.7     Wet Etch Market Shares                                                           7-35