RF Component Industry Review: October - December 2014

Global shipments of cellphones surpassed a half billion units in Q4 ’14, and sales and profits strengthened for suppliers of front-end components in phones. Notable products achievements included Qualcomm’s announcement of the first LTE-A Cat. 10 chipset, new Bluetooth Smart and Bluetooth Mesh ICs for wearables and Internet of Things applications, UWB for indoor location, and an increase in activity in 60 GHz radio chips.

1 Executive Summary
2 Summary and Analysis of Significant Developments
2.1 Financial Highlights
2.2 Product, Market, Technology Highlights
2.3 Mergers, Acquisitions, Divestitures
2.4 RF Startup Funding
3 Company Results
3.1 Financial
3.1.1 Alien Technology Raises $35 Million
3.1.2 Intel Q3 FY `14
3.1.3 Blu Wireless $3.7 Million Investment Round
3.1.4 TSMC Q3 FY `14
3.1.5 Nordic Q3 FY `14
3.1.6 Cypress Q3 FY `14
3.1.7 TI Q3 FY `14
3.1.8 Broadcom Q3 FY `14
3.1.9 Cree Q1 FY `15
3.1.10 Melexis Q3 FY `14
3.1.11 Freescale Q3 FY `14
3.1.12 Maxim Q1 FY `15
3.1.13 NXP Q3 FY `14
3.1.14 Sequans Q3 FY `14
3.1.15 Silicon Labs Q3 FY `14
3.1.16 ANADIGICS Q3 FY `14
3.1.17 TriQuint Q3 FY `14
3.1.18 Atmel Q3 FY `14
3.1.19 Cavium Q3 FY `14
3.1.20 Peraso Raises $20 Million
3.1.21 RFMD Q2 FY `15
3.1.22 UMC Q3 FY `14
3.1.23 CEVA Q3 FY `14
3.1.24 Fujitsu Q2 FY 2014
3.1.25 InterDigital Q3 FY `14
3.1.26 Seiko-Epson Q2 FY `15
3.1.27 SEI Q2 FY `14
3.1.28 Murata Q2 FY 2015
3.1.29 Renesas Q2 FY 2015
3.1.30 Sony Q2 FY `15
3.1.31 TDK Q2 FY `15
3.1.32 DSP Group Q3 FY `14
3.1.33 Qualcomm Q4 and FY 2014
3.1.34 MediaTek Q3 FY `14
3.1.35 Microsemi Q4 and FY `14
3.1.36 Nvidia Q3 FY `15
3.1.37 Skyworks Q4 and FY `14
3.1.38 NDK Q2 FY '15
3.1.39 Entropic Q3 FY `14
3.1.40 CSR Q3 FY `14
3.1.41 TowerJazz Q3 FY '14
3.1.42 Marvell Q3 FY `15
3.1.43 Taiyo Yuden Q2 FY `15
3.1.44 Analog Devices Q4 and FY `14
3.1.45 Infineon Q4 and FY '14
3.1.46 Avago Q4 and FY '14
3.1.47 IMGTEC H1 FY `14
3.1.48 Quantenna Raises $22 Million
3.2 Contracts
3.2.1 Components in Apple iPhone 6 Variants
3.2.2 Sequans in Devices Offered by Globe Telecom
3.2.3 ANADIGICS in Samsung Phablet
3.2.4 MediaTek Wi-Fi in Amazon Tablets
3.2.5 MediaTek Ships LTE SoC for Phones in India
3.2.6 Qualcomm Places Order with UMC
3.2.7 Quantenna in Linksys Router
3.2.8 LG Radio Processor Used in Latest LG Smartphone
3.2.9 SoftAtHome Wi-Fi Embedded Platform Uses Quantenna
3.2.10 Telenor Connexion Using u-blox for M2M
3.2.11 Murata to Supply ISA100 Modules to Yokogawa
3.2.12 Skyworks Diversity Receive Modules
3.2.13 Sequans in New Tablet
3.2.14 Taiyo Yuden Bluetooth Smart Module for IoT
3.2.15 Altair in Asus Laptop
3.2.16 Marvell in Meizu Smartphone
3.2.17 Huawei Smartphone Using ANADIGICS Wi-Fi
3.2.18 GCT Semi in NEC Mobile Router
3.2.19 Ruckus Wireless Using Qualcomm Wi-Fi with MU-MIMO
3.2.20 Cohda Wireless Using u-blox for V2X
3.2.21 Wirepas Using Nordic Semi for Bluetooth Mesh
3.2.22 Marvell Automotive LTE Module
3.2.23 LG Innotek Using CSR for Automotive Connectivity
3.3 Joint Ventures
3.3.1 MegaChips Joins Imec & Holst Centre Program on Ultra-low Power Radio
3.4 Employment
3.4.1 Entropic Changes CEOs
3.4.2 Intel Combines Mobile Communications & PC Divisions
3.4.3 Wearables Executive Leaves Qualcomm
3.4.4 Qualcomm Eliminates Positions
3.5 New Products
3.5.1 ARM Platform for IoT
3.5.2 ANADIGICS Small-Cell PAs
3.5.3 Sumitomo Electric E-band MMICs
3.5.4 M/A-COM E-Band Driver Amplifier
3.5.5 Skyworks SoI Switch
3.5.6 Samsung 60 GHz Wi-Fi
3.5.7 MediaTek Mainstream Smartphone Platform
3.5.8 Analog Devices Satcom Upconverter and PA
3.5.9 Peregrine Semi SoI Switch for Cable TV
3.5.10 Silicon Labs Launches New Silicon TV Tuners
3.5.11 MegaChips Sub-GHz Radio Chip
3.5.12 Atmel RF Transceiver for Smart Energy and Building Automation
3.5.13 Anadigics VCOs
3.5.14 TI Wi-Fi Combo Modules
3.5.15 CSR Bluetooth Smart for Automotive
3.5.16 TDK-EPC Duplexer for LTE Band 1
3.5.17 Cypress Bluetooth Low Energy
3.5.18 TSMC 16 nm FinFET Process
3.5.19 FCC Sets AWS-3 Auction Close for Early 2015
3.5.20 CSR Bluetooth High Definition Audio
3.5.21 TriQuint RF Filters for LTE Coexistence
3.5.22 Marvell New 64-bit LTE SoCs
3.5.23 Decawave UWB for Indoor Location
3.5.24 Qualcomm LTE Cat. 10 Chipset
3.5.25 Lime Microsystems Field-Programmable RF
3.5.26 Freescale GaN RF Power
3.5.27 Broadcom GNSS with Galileo for Smartphones
3.5.28 Broadcom NFC for IoT
3.5.29 Broadcom Dual-Band Wi-Fi Audio Chip for Internet of Things
3.5.30 Silicon Labs TV Demods
3.5.31 BEEcube 5G RRH Platform
3.5.32 Freescale Wireless Charging
3.5.33 TI NFC for IoT
3.5.34 Analog Devices DC Receiver for Radar
3.5.35 Silicon Labs 802.15.4/4g
3.5.36 Qualcomm LTE Processor for Cat. 9
3.5.37 Broadcom Satellite ODUs with GPS
3.5.38 Anadigics Wi-Fi PA for Infrastructure
3.5.39 Peraso 60 GHz Radio
3.5.40 Samsung Smartphone with 3xDL CA
3.6 Other
3.6.1 Infineon to Acquire International Rectifier
3.6.2 TSMC & ARM Validate 16 nm FinFET Process
3.6.3 HMS Networks Acquires Product Line from u-blox
3.6.4 FCC Investigates 24 GHz and Above for 5G
3.6.5 MaxLinear to Acquire Physpeed
3.6.6 Samsung to Build New Fab in Israel
3.6.7 Fujitsu Labs mm-Wave Radar for Automobiles
3.6.8 RF Energy Alliance Formed
3.6.9 Samsung Establishes 5G Speed Record
3.6.10 Qualcomm to Acquire CSR
3.6.11 GlobalFoundries to Acquire IBM Micro
3.6.12 NAB Challenges 600 MHz Auctions
3.6.13 MegaChips to Acquire SiTime
3.6.14 China to Issue FDD-LTE Licenses
3.6.15 MaxLinear Ships 10 Millionth TV Tuner
3.6.16 CEA-Leti UWB Prototype
3.6.17 ZigBee 3.0 Standard
3.6.18 M/A-COM Tech to Acquire BinOptics
3.6.19 NXP Semi to Acquire Quintic Product Lines
3.6.20 RFMD & TriQuint Merger
3.6.21 u-blox Acquires Lesswire Module Business
3.6.22 Samsung Starts 14 nm FinFET Chip Production
3.6.23 Bluetooth SIG Finalizes Bluetooth 4.2
3.6.24 Fujitsu Labs Develops New RFID Tag
3.6.25 NTT DoCoMo Develops Thin-Film Filter
3.6.26 Qualcomm to Invest $40 M in Chinese Companies
3.6.27 Murata Completes Acquisition of Peregrine Semi
3.6.28 GainSpan Joins Thread
3.6.29 SMIC Supplies 28 nm Processors to Qualcomm
3.6.30 Nordic Semi IPv6 Stack for Bluetooth Smart
3.6.31 T-Mobile US Plans LTE-U Launch
3.6.32 JCET and SMIC to Acquire STATS ChipPAC
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