Thin Wafer Market - Global Trend and Forecast to 2022

The thin wafer market is expected to grow at a CAGR of 3.7% between 2016 and 2022 and estimated to reach USD 9.17 billion by 2022. A key driving factor for the growth of the thin wafer market is the reduction in the size of electronic devices. Besides, several other factors such as growing mobile and consumer electronics markets and high amount of material saving are also propelling the growth of the market.
“300mm diameter wafer expected to grow at the highest CAGR”:
In the thin wafer market, the 300mm wafer is estimated to grow at a significant pace during the forecast period. Till recent times, semiconductor manufacturers used 150mm and 200mm diameter size wafer for the development of semiconductor devices. Presently, the use of 300mm wafer is increasing due to its high production capacity for semiconductor devices.
“APAC to be the fastest-growing region in the thin wafer market”

The market in APAC is expected to grow at the highest CAGR between 2016 and 2022. The growth is attributed to increasing industrialization and urbanization in this region. The growing semiconductor industry in APAC is the main factor responsible for the increasing adoption of thin wafers in the region. Further, the cheap labor cost, high demand of consumer electronic devices, and favorable economic conditions are some of the reasons for the high growth of thin wafers in this region.

Several primary interviews with experts have been conducted across four major regions, namely, North America, Europe, Asia-Pacific, and Rest of the World (the Middle East, Africa, and South America). The primary participants considered for the study are C level executives, managers, and D level executives of tier 1, tier 2, and tier 3 companies. The breakdown of primary interviews is as follows:
‧ By Company Type-Tier 1- 55%, Tier 2- 20%, Tier 3- 25%
‧ By Designation –C Level- 49%, Manager Level- 31%, Director level- 20%
‧ By Region- North America-20%, Europe-40%, Asia-Pacific-30%, RoW-10%

The key players operating in this market include LG Siltronic, Inc. (South Korea), Shin-Etsu Chemical Co. (Japan), Siltronic AG (Germany), Sumco Corporation (Japan), Sunedision Semiconductor Ltd. (U.S.), SUSS Microtec AG (Germany), Lintec Corporation (Japan), Disco Corporation (Japan), 3M (U.S.), Applied Materials, Inc. (U.S.), Nissan Chemical Corporation (Japan), Synova (Switzerland), EV Group (U.S.), Brewer Science, Inc. (U.S.), and Ulvac GmbH (Germany).

“Reasons to buy the report”:
‧ This report includes the market statistics pertaining to wafer size, semiconductor device applications, and geography along with their respective revenues.
‧ The Porter’s five forces framework has been utilized along with the value chain analysis to provide an in-depth insight into the thin wafer market.
‧ Major drivers, restraints, and opportunities for the thin wafer market have been detailed in this report.
‧ Illustrative segmentation, analyses, and forecasts for the market based on wafer size, application, and geography have been conducted to give an overall view of the thin wafer market.
‧ A detailed competitive landscape includes key players, in-depth analysis, and revenue of key players.

TABLE OF CONTENTS

1 INTRODUCTION 12
1.1 OBJECTIVES OF THE STUDY 12
1.2 MARKET DEFINITION 12
1.3 MARKET SCOPE 13
1.3.1 MARKET COVERED 13
1.3.2 YEARS CONSIDERED FOR THE STUDY 13
1.4 CURRENCY AND PRICING 14
1.5 MARKET STAKEHOLDERS 14
2 RESEARCH METHODOLOGY 15
2.1 RESEARCH DATA 15
2.1.1 SECONDARY DATA 16
2.1.1.1 Key data from secondary sources 16
2.1.2 PRIMARY DATA 17
2.1.2.1 Key data from primary sources 17
2.1.2.2 Key industry insights 18
2.1.2.3 Breakdown of primaries 18
2.2 MARKET ESTIMATION 19
2.2.1 BOTTOM-UP APPROACH 19
2.2.2 TOP-DOWN APPROACH 20
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 21
2.4 RESEARCH ASSUMPTIONS AND LIMITATIONS 22
2.4.1 ASSUMPTIONS 22
2.4.2 LIMITATIONS 22
3 EXECUTIVE SUMMARY 23
4 PREMIUM INSIGHTS 27
4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN THE THIN WAFER MARKET 27
4.2 THIN WAFER MARKET, BY APPLICATION 27
4.3 THIN WAFER MARKET IN THE APAC REGION, 2015 28
4.4 U.S. TO HOLD THE LARGEST SHARE OF THE THIN WAFER MARKET IN 2015 29
5 MARKET OVERVIEW 30
5.1 INTRODUCTION 31
5.2 MARKET SEGMENTATION 31
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5.3 MARKET DYNAMICS 32
5.3.1 DRIVERS 33
5.3.1.1 Reduction in the size of electronic devices 33
5.3.1.2 Growing mobile and consumer electronics markets 33
5.3.1.3 High amount of material saving 34
5.3.2 RESTRAINTS 35
5.3.2.1 Efficiency maintenance is major issue in the thin wafer market 35
5.3.3 OPPORTUNITIES 36
5.3.3.1 Growing IC industry in China 36
5.3.3.2 High adoption of portable devices 36
5.3.4 OPPORTUNITIES 37
5.3.5 CHALLENGES 37
5.3.5.1 Volatility and susceptibility to damage 37
6 INDUSTRY TREND 38
6.1 INTRODUCTION 38
6.2 PORTER’S FIVE FORCES ANALYSIS 39
6.2.1 THREAT OF SUBSTITUTES 41
6.2.2 BARGAINING POWER OF SUPPLIERS 42
6.2.3 BARGAINING POWER OF BUYERS 43
6.2.4 DEGREE OF COMPETITION 44
6.2.5 THREAT OF NEW ENTRANTS 45
7 THIN WAFER HANDLING MARKET, BY PROCESS 46
7.1 INTRODUCTION 47
7.2 TEMPORARY BONDING & DEBONDING 48
7.2.1 MARKET ADHESIVES 48
7.2.1.1 UV-Release Adhesives 48
7.2.1.2 Thermal-Release Adhesives 48
7.2.1.3 Solvent-Release Adhesives 48
7.3 CARRIER–LESS APPROACH (TAIKO PROCESS) 49
8 THIN WAFER MARKET, BY WAFER SIZE 50
8.1 INTRODUCTION 51
8.2 125MM 52
8.3 200MM 53
8.4 300MM 54
9 THIN WAFER MARKET, BY APPLICATION 56
9.1 INTRODUCTION 57
9.2 MEMS 59
9.3 CMOS IMAGE SENSOR 60
9.4 MEMORY 61
9.5 RF DEVICES 63
9.6 LED 64
9.7 INTERPOSERS 66
9.8 LOGIC 67
9.9 OTHERS 68
10 THIN WAFER MARKET, BY GEOGRAPHY 69
10.1 INTRODUCTION 70
10.2 NORTH AMERICA 71
10.3 EUROPE 73
10.4 APAC 75
11 COMPETITIVE LANDSCAPE 78
11.1 COMPETITIVE LANDSCAPE OVERVIEW 78
11.2 MARKET RANKING ANALYSIS 79
11.3 COMPETITIVE SITUATION AND TRENDS 80
11.3.1 NEW PRODUCT DEVELOPMENTS/LAUNCHES 81
11.3.2 CONTRACTS, AGREEMENTS, PARTNERSHIPS, AND COLLABORATIONS 82
11.3.3 MERGERS & ACQUISITIONS 82
11.3.4 EXPANSIONS AND JOINT VENTURES, (2013-2014) 83
12 COMPANY PROFILES 84
(Overview, Products and Services, Financials, Strategy & Development)*
12.1 INTRODUCTION 84
12.2 LG SILTRON INC. 85
12.3 SHIN-ETSU CHEMICAL CO., LTD. 87
12.4 SILTRONIC AG 90
12.5 SUMCO CORPORATION 93
12.6 SUNEDISON SEMICONDUCTOR LTD. 95
12.7 SUSS MICRO TEC AG 97
12.8 LINTEC CORPORATION 99
12.9 DISCO CORPORATION 101
12.10 3M 103
12.11 APPLIED MATERIALS, INC. 105
12.12 NISSAN CHEMICAL CORPORATION 107
12.13 MECHATRONIK SYSTEMTECHNIK GMBH. 109
12.14 SYNOVA 110
12.15 EV GROUP 111
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12.16 BREWER SCIENCE INC. 113
12.17 ULVAC GMBH 115
*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.
13 APPENDIX 116
13.1 INSIGHTS OF INDUSTRY EXPERTS 116
13.2 DISCUSSION GUIDE 117
13.3 INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE 120
13.4 AVAILABLE CUSTOMIZATIONS 121
13.5 RELATED REPORTS 121