LCD MARKET: TECHNOLOGY, DIRECTIONS, AND MARKET ANALYSIS
出 版 商：The Information Network
出版日期：2016/10/01
價 格：
USD 2,495 (Single-User License)
Chapter 1 Introduction 1-1
Chapter 2 Executive Summary 2-1
2.1 Introduction 2-1
2.2 Market Opportunities 2-4
Chapter 3 Profiles of Japanese Companies 3-1
3.1 Equipment Manufacturers 3-1
3.2 Material Manufacturers 3-9
3.3 LCD Manufacturers 3-17
Chapter 4 Profiles of US Companies 4-1
4.1 Equipment Manufacturers 4-1
4.2 Material Manufacturers 4-5
4.3 LCD Manufacturers 4-7
Chapter 5 Profiles of ROW Companies 5-1
5.1 Equipment Manufacturers 5-1
5.2 Material Manufacturers 5-3
5.3 LCD Manufacturers 5-10
5.4 Mainland China 5-25
Chapter 6 The AMLCD Factory 6-1
6.1 Factory Logistics 6-1
6.1.1 Investment Needs 6-1
6.1.2 Capacity 6-8
6.1.3 Plant Size 6-11
6.2 Cleanrooms 6-12
6.3 Automation 6-16
6.4 Active Matrix LCD Production Trends 6-19
6.4.1 TFT-LCD 6-20
6.4.1.1 IPS 6-29
6.4.1.2 MVA 6-31
6.4.1.3 PVA 6-31
6.4.2 Passive Matrix LCD 6-32
6.4.3 Ferroelectric LCDs 6-32
6.5 Electrophoretic Display 6-33
6.6 Plastic LCDs 6-38
6.7 Organic Light-Emitting Diode (OLED) 6-44
Chapter 7 Equipment Requirements and Trends 7-1
7.1 Introduction 7-1
7.2 Microlithography 7-23
7.2.1 Proximity Printing 7-23
7.2.2 Scanning Projection 7-24
7.2.3 Step-and-Repeat 7-25
o Image Field Stitching 7-28
o Overlay 7-29
7.3 Deposition 7-30
7.3.1 CVD 7-30
7.3.2 Sputtering 7-38
7.4 Rapid Thermal Processing 7-43
7.5 Etch/Strip/Clean 7-42
7.5.1 Etching 7-45
o Plasma Etching 7-45
o Wet Chemical Etching 7-47
7.5.2 Photoresist Stripping 7-50
7.5.3 Cleaning 7-51
7.6 Inspection Systems 7-54
7.7 Test Systems 7-59
7.7.1 Technology Capabilities 7-59
o Voltage/Capacitance Imaging 7-59
o Ohmic/Continuity Test 7-59
o Charge Sensing 7-60
o Forward Admittance Sensing 7-60
o E-Beam Test 7-60
7.7.2 Yield Improvements 7-64
7.8 Repair 7-65
Chapter 8 Material Requirements and Trends 8-1
8.1 Substrates 8-1
8.1.1 Material Types 8-1
8.1.2 Quality Issues 8-2
8.1.3 Trends 8-4
o Larger Substrates 8-4
o Thinner Substrates 8-6
o Better Surface 8-6
o Higher Temperature Capability 8-7
o Manufacturers 8-7
8.2 Liquid Crystals 8-9
8.2.1 Introduction 8-9
8.2.2 OLEDs and Light-Emitting Polymers 8-16
8.3 Alignment Layer 8-27
8.3.1 Material Properties 8-27
8.3.2 Material Trends 8-30
8.4 Color Filters 8-31
8.4.1 Materials 8-31
8.5 Polarizer Films 8-38
8.5.1 Material Properties and Trends 8-38
Chapter 9 Market Forecast 9-1
9.1 Getting To Market 9-1
9.2 Market Forecast Assumptions 9-8
9.3 LCD Market Forecast 9-9
9.4 Equipment Market Forecast and Trends 9-30
9.4.1 Lithography 9-30
9.4.2 Plasma Etching and Stripping 9-32
9.4.3 Thin Film Deposition 9-34
9.4.4 Wet Etching and Cleaning 9-36
9.4.5 Photoresist Processing 9-38
9.4.6 Inspection/Repair 9-40
9.4.7 Total Equipment Market 9-42
9.5 Materials Market Forecast and Trends 9-49
9.5.1 LCD Materials Market 9-52
9.5.2 LCD Glass Market 9-57
9.5.3 Gases Market
List of Figures
6.1 FPD Stocker and Lifter 6-17
6.2 Amorphous Silicon AM Fabrication Process 6-25
6.3 AMLCD Cross Section 6-26
6.4 Electrophoretic Display Cross Section 6-34
6.5 Schematic of a 2-Layer OLED 6-46
7.1 Schematic of Step-and-Repeat Aligner 7-26
7.2 Schematic of Hot-Wall LPCVD Reactors 7-31
7.3 Schematic of PECVD Techniques 7-33
7.4 Diagram of Magnetron Sputtering Source 7-40
7.5 Diagram of Rapid Thermal Processor 7-44
7.6 Process Flow for Cell/Module Inspection 7-56
8.1 Light-Emitting Polymer Structure 8-19
8.2 LEP Structure Cross Section 8-21
8.3 Ink-Jet Printing Of LEP Structure 8-26
8.4 Comparison of Color Filter Methods 8-32
9.1 Worldwide Large Panel Display Market Forecast 9-16
9.2 Worldwide LCD PC Monitor Market Forecast 9-18
9.3 Worldwide Large-Size TFT Shipments By Region 9-20
9.4 North American LCD TV Shipments 9-22
9.5 North American Plasma TV Shipments 9-23
10.1 Worldwide TFT-LCD Equipment Market Growth 9-46
11.1 Cost Structure of a 17-inch LCD Monitor Panel 9-50
11.2 Worldwide Large Area LCD Glass Market Demand 9-53
11.3 Worldwide Large Area LCD Glass Market Share 9-55
11.4 Worldwide Large Area LCD Glass Market Share 5G and Above 9-56
11.5 Electronic Specialty Gases (ESGS) Market 9-58
11.6 Electronic Bulk Gases (EBGS) Market 9-59
11.7 Gases Used To Manufacture Displays 9-60
List of Tables
8.1 Common Wafer Processing Chemicals
8.2 Advantages and Disadvantages of Various Cleaning Methods
9.1 Worldwide LCD Display Market Forecast
9.2 Major LCD Panel Makers Market Share 2006-present
9.3 Major LCD Panel Makers Capacity
9.4 Worldwide TFT-LCD Stepper/Scanner Market Forecast
9.5 Worldwide Market Forecast of TFT-LCD Plasma Etching Systems
9.6 Forecast of Worldwide TFT-LCD Thin Film Deposition Equipment Market
9.7 Forecast of Worldwide TFT-LCD Wet Etching and Cleaning Equipment Market
9.8 Forecast of Worldwide TFT-LCD Photoresist Processing Equipment Market
9.9 Forecast of Worldwide TFT-LCD Inspection/Repair Equipment Market
9.10 Forecast of Worldwide TFT-LCD Equipment Market
9.11 Worldwide Equipment Market Shares
9.12 TFT-LCD Material And Component Revenues
Chapter 2 Executive Summary 2-1
2.1 Introduction 2-1
2.2 Market Opportunities 2-4
Chapter 3 Profiles of Japanese Companies 3-1
3.1 Equipment Manufacturers 3-1
3.2 Material Manufacturers 3-9
3.3 LCD Manufacturers 3-17
Chapter 4 Profiles of US Companies 4-1
4.1 Equipment Manufacturers 4-1
4.2 Material Manufacturers 4-5
4.3 LCD Manufacturers 4-7
Chapter 5 Profiles of ROW Companies 5-1
5.1 Equipment Manufacturers 5-1
5.2 Material Manufacturers 5-3
5.3 LCD Manufacturers 5-10
5.4 Mainland China 5-25
Chapter 6 The AMLCD Factory 6-1
6.1 Factory Logistics 6-1
6.1.1 Investment Needs 6-1
6.1.2 Capacity 6-8
6.1.3 Plant Size 6-11
6.2 Cleanrooms 6-12
6.3 Automation 6-16
6.4 Active Matrix LCD Production Trends 6-19
6.4.1 TFT-LCD 6-20
6.4.1.1 IPS 6-29
6.4.1.2 MVA 6-31
6.4.1.3 PVA 6-31
6.4.2 Passive Matrix LCD 6-32
6.4.3 Ferroelectric LCDs 6-32
6.5 Electrophoretic Display 6-33
6.6 Plastic LCDs 6-38
6.7 Organic Light-Emitting Diode (OLED) 6-44
Chapter 7 Equipment Requirements and Trends 7-1
7.1 Introduction 7-1
7.2 Microlithography 7-23
7.2.1 Proximity Printing 7-23
7.2.2 Scanning Projection 7-24
7.2.3 Step-and-Repeat 7-25
o Image Field Stitching 7-28
o Overlay 7-29
7.3 Deposition 7-30
7.3.1 CVD 7-30
7.3.2 Sputtering 7-38
7.4 Rapid Thermal Processing 7-43
7.5 Etch/Strip/Clean 7-42
7.5.1 Etching 7-45
o Plasma Etching 7-45
o Wet Chemical Etching 7-47
7.5.2 Photoresist Stripping 7-50
7.5.3 Cleaning 7-51
7.6 Inspection Systems 7-54
7.7 Test Systems 7-59
7.7.1 Technology Capabilities 7-59
o Voltage/Capacitance Imaging 7-59
o Ohmic/Continuity Test 7-59
o Charge Sensing 7-60
o Forward Admittance Sensing 7-60
o E-Beam Test 7-60
7.7.2 Yield Improvements 7-64
7.8 Repair 7-65
Chapter 8 Material Requirements and Trends 8-1
8.1 Substrates 8-1
8.1.1 Material Types 8-1
8.1.2 Quality Issues 8-2
8.1.3 Trends 8-4
o Larger Substrates 8-4
o Thinner Substrates 8-6
o Better Surface 8-6
o Higher Temperature Capability 8-7
o Manufacturers 8-7
8.2 Liquid Crystals 8-9
8.2.1 Introduction 8-9
8.2.2 OLEDs and Light-Emitting Polymers 8-16
8.3 Alignment Layer 8-27
8.3.1 Material Properties 8-27
8.3.2 Material Trends 8-30
8.4 Color Filters 8-31
8.4.1 Materials 8-31
8.5 Polarizer Films 8-38
8.5.1 Material Properties and Trends 8-38
Chapter 9 Market Forecast 9-1
9.1 Getting To Market 9-1
9.2 Market Forecast Assumptions 9-8
9.3 LCD Market Forecast 9-9
9.4 Equipment Market Forecast and Trends 9-30
9.4.1 Lithography 9-30
9.4.2 Plasma Etching and Stripping 9-32
9.4.3 Thin Film Deposition 9-34
9.4.4 Wet Etching and Cleaning 9-36
9.4.5 Photoresist Processing 9-38
9.4.6 Inspection/Repair 9-40
9.4.7 Total Equipment Market 9-42
9.5 Materials Market Forecast and Trends 9-49
9.5.1 LCD Materials Market 9-52
9.5.2 LCD Glass Market 9-57
9.5.3 Gases Market
List of Figures
6.1 FPD Stocker and Lifter 6-17
6.2 Amorphous Silicon AM Fabrication Process 6-25
6.3 AMLCD Cross Section 6-26
6.4 Electrophoretic Display Cross Section 6-34
6.5 Schematic of a 2-Layer OLED 6-46
7.1 Schematic of Step-and-Repeat Aligner 7-26
7.2 Schematic of Hot-Wall LPCVD Reactors 7-31
7.3 Schematic of PECVD Techniques 7-33
7.4 Diagram of Magnetron Sputtering Source 7-40
7.5 Diagram of Rapid Thermal Processor 7-44
7.6 Process Flow for Cell/Module Inspection 7-56
8.1 Light-Emitting Polymer Structure 8-19
8.2 LEP Structure Cross Section 8-21
8.3 Ink-Jet Printing Of LEP Structure 8-26
8.4 Comparison of Color Filter Methods 8-32
9.1 Worldwide Large Panel Display Market Forecast 9-16
9.2 Worldwide LCD PC Monitor Market Forecast 9-18
9.3 Worldwide Large-Size TFT Shipments By Region 9-20
9.4 North American LCD TV Shipments 9-22
9.5 North American Plasma TV Shipments 9-23
10.1 Worldwide TFT-LCD Equipment Market Growth 9-46
11.1 Cost Structure of a 17-inch LCD Monitor Panel 9-50
11.2 Worldwide Large Area LCD Glass Market Demand 9-53
11.3 Worldwide Large Area LCD Glass Market Share 9-55
11.4 Worldwide Large Area LCD Glass Market Share 5G and Above 9-56
11.5 Electronic Specialty Gases (ESGS) Market 9-58
11.6 Electronic Bulk Gases (EBGS) Market 9-59
11.7 Gases Used To Manufacture Displays 9-60
List of Tables
8.1 Common Wafer Processing Chemicals
8.2 Advantages and Disadvantages of Various Cleaning Methods
9.1 Worldwide LCD Display Market Forecast
9.2 Major LCD Panel Makers Market Share 2006-present
9.3 Major LCD Panel Makers Capacity
9.4 Worldwide TFT-LCD Stepper/Scanner Market Forecast
9.5 Worldwide Market Forecast of TFT-LCD Plasma Etching Systems
9.6 Forecast of Worldwide TFT-LCD Thin Film Deposition Equipment Market
9.7 Forecast of Worldwide TFT-LCD Wet Etching and Cleaning Equipment Market
9.8 Forecast of Worldwide TFT-LCD Photoresist Processing Equipment Market
9.9 Forecast of Worldwide TFT-LCD Inspection/Repair Equipment Market
9.10 Forecast of Worldwide TFT-LCD Equipment Market
9.11 Worldwide Equipment Market Shares
9.12 TFT-LCD Material And Component Revenues
