Global High-bandwidth Memory Market 2018-2022

About High-bandwidth Memory

High-bandwidth memory (HBM) is a dynamic random-access memory (DRAM) technology approved by the Joint Electron Device Engineering Council (JEDEC) as an industry standard. The technology uses through-silicon vias (TSVs) and a silicon interposer technology to interconnect stacked DRAM dies.

Technavio’s analysts forecast the global high-bandwidth memory market to grow at a CAGR of 32.09% during the period 2018-2022.

Covered in this report
The report covers the present scenario and the growth prospects of the global high-bandwidth memory market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
‧ Americas
‧ APAC
‧ EMEA

Technavio's report, Global High-bandwidth Memory Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
‧ Advanced Micro Devices
‧ Intel
‧ SAMSUNG
‧ SK HYNIX
‧ XILINX

Market driver
‧ Increasing demand for HPC
‧ For a full, detailed list, view our report

Market challenge
‧ Exorbitant costs
‧ For a full, detailed list, view our report

Market trend
‧ Growth of AI
‧ For a full, detailed list, view our report

Key questions answered in this report
‧ What will the market size be in 2022 and what will the growth rate be?
‧ What are the key market trends?
‧ What is driving this market?
‧ What are the challenges to market growth?
‧ Who are the key vendors in this market space?

You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
‧ Market ecosystem
‧ Market characteristics
‧ Market segmentation analysis
PART 05: MARKET SIZING
‧ Market definition
‧ Market sizing 2017
‧ Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
‧ Bargaining power of buyers
‧ Bargaining power of suppliers
‧ Threat of new entrants
‧ Threat of substitutes
‧ Threat of rivalry
‧ Market condition
PART 07: MARKET SEGMENTATION BY APPLICATION
‧ Segmentation by application
‧ Comparison by application
‧ HPC – Market size and forecast 2017-2022
‧ Graphics – Market size and forecast 2017-2022
‧ Others – Market size and forecast 2017-2022
‧ Market opportunity by application
PART 08: MARKET SEGMENTATION BY PRODUCT
‧ Segmentation by product
‧ GPU – Market analysis
‧ CPU – Market analysis
‧ APU – Market analysis
‧ ASIC – Market analysis
‧ FPGA – Market analysis
PART 09: CUSTOMER LANDSCAPE
PART 10: REGIONAL LANDSCAPE
‧ Geographical segmentation
‧ Regional comparison
‧ Americas – Market size and forecast 2017-2022
‧ APAC – Market size and forecast 2017-2022
‧ EMEA – Market size and forecast 2017-2022
‧ Key leading countries
‧ Market opportunity
PART 11: DECISION FRAMEWORK
PART 12: DRIVERS AND CHALLENGES
‧ Market drivers
‧ Market challenges
PART 13: MARKET TRENDS
‧ Growth of AI
‧ Increasing interest in HMC
‧ Increasing interest toward quantum computing
PART 14: VENDOR LANDSCAPE
‧ Overview
‧ Landscape disruption
‧ Competitive scenario
PART 15: VENDOR ANALYSIS
‧ Vendors covered
‧ Vendor classification
‧ Market positioning of vendors
‧ Advanced Micro Devices
‧ Intel
‧ SAMSUNG
‧ SK HYNIX
‧ XILINX
PART 16: APPENDIX
‧ List of abbreviations



Exhibit 01: Parent market
Exhibit 02: Global memory market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition - Inclusions and exclusions checklist
Exhibit 06: Market size 2017
Exhibit 07: Validation techniques employed for market sizing 2017
Exhibit 08: Global – Market size and forecast 2017-2022 ($ mn)
Exhibit 09: Global – Year-over-year growth 2018-2022 (%)
Exhibit 10: Five forces analysis 2017
Exhibit 11: Five forces analysis 2022
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: Threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition - Five forces 2017
Exhibit 18: Application – Market share 2017-2022 (%)
Exhibit 19: Comparison by application
Exhibit 20: HPC – Market size and forecast 2017-2022 ($ mn)
Exhibit 21: HPC – Year-over-year growth 2018-2022 (%)
Exhibit 22: Graphics – Market size and forecast 2017-2022 ($ mn)
Exhibit 23: Graphics – Year-over-year growth 2018-2022 (%)
Exhibit 24: Others – Market size and forecast 2017-2022 ($ mn)
Exhibit 25: Others – Year-over-year growth 2018-2022 (%)
Exhibit 26: Market opportunity by application
Exhibit 27: Customer landscape
Exhibit 28: Global – Market share by geography 2017-2022 (%)
Exhibit 29: Comparison by region
Exhibit 30: Americas – Market size and forecast 2017-2022 ($ mn)
Exhibit 31: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 32: APAC – Market size and forecast 2017-2022 ($ mn)
Exhibit 33: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 34: EMEA – Market size and forecast 2017-2022 ($ mn)
Exhibit 35: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 36: Key leading countries
Exhibit 37: Market opportunity
Exhibit 38: Vendor landscape
Exhibit 39: Landscape disruption
Exhibit 40: Vendors covered
Exhibit 41: Vendor classification
Exhibit 42: Market positioning of vendors
Exhibit 43: Vendor overview
Exhibit 44: Advanced Micro Devices – Business segments
Exhibit 45: Advanced Micro Devices – Organizational developments
Exhibit 46: Advanced Micro Devices – Geographic focus
Exhibit 47: Advanced Micro Devices – Segment focus
Exhibit 48: Advanced Micro Devices – Key offerings
Exhibit 49: Intel: Overview
Exhibit 50: Intel – Business segments
Exhibit 51: Intel – Organizational developments
Exhibit 52: Intel – Geographic focus
Exhibit 53: Intel– Segment focus
Exhibit 54: Intel– Key offerings
Exhibit 55: SAMSUNG: Overview
Exhibit 56: SAMSUNG– Business segments
Exhibit 57: SAMSUNG – Organizational developments
Exhibit 58: SAMSUNG – Geographic focus
Exhibit 59: SAMSUNG – Segment focus
Exhibit 60: SAMSUNG – Key offerings
Exhibit 61: SK HYNIX: Overview
Exhibit 62: SK HYNIX – Business segments
Exhibit 63: SK HYNIX – Organizational developments
Exhibit 64: SK HYNIX – Geographic focus
Exhibit 65: SK HYNIX – Segment focus
Exhibit 66: SK HYNIX – Key offerings
Exhibit 67: XILINX: Overview
Exhibit 68: XILINX – Business segments
Exhibit 69: XILINX – Organizational developments
Exhibit 70: XILINX – Geographic focus
Exhibit 71: XILINX– Key offerings