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Global Probe Card Market 2018-2022
出 版 商：Technavio
出版日期：2018/07/17
頁 數：115頁
文件格式：PDF
價 格：
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USD 4,000 (Global-User License)
About Probe Card
Probe card is used for electrical testing of individual integrated circuits (ICs), which are present on a wafer, during the production of semiconductor devices. A wafer probe carries out the testing to identify functional defects in the wafer.
Technavio’s analysts forecast the global probe card market to grow at a CAGR of 4.58% during the period 2018-2022.
Covered in this report
The report covers the present scenario and the growth prospects of the global probe card market for 2018-2022. To calculate the market size, the report considers the revenue generated from use of probe cards across several end-user industries.
The market is divided into the following segments based on geography:
‧ Americas
‧ APAC
‧ EMEA
Technavio's report, Global Probe Card Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
‧ FormFactor
‧ JAPAN ELECTRONIC MATERIALS
‧ MICRONICS JAPAN
‧ MPI
‧ Technoprobe
Market driver
‧ Miniaturization of electronic products
‧ For a full, detailed list, view our report
Market challenge
‧ Rapid technological changes in semiconductor industry
‧ For a full, detailed list, view our report
Market trend
‧ Growing adoption of 3-D NAND
‧ For a full, detailed list, view our report
Key questions answered in this report
‧ What will the market size be in 2022 and what will the growth rate be?
‧ What are the key market trends?
‧ What is driving this market?
‧ What are the challenges to market growth?
‧ Who are the key vendors in this market space?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Probe card is used for electrical testing of individual integrated circuits (ICs), which are present on a wafer, during the production of semiconductor devices. A wafer probe carries out the testing to identify functional defects in the wafer.
Technavio’s analysts forecast the global probe card market to grow at a CAGR of 4.58% during the period 2018-2022.
Covered in this report
The report covers the present scenario and the growth prospects of the global probe card market for 2018-2022. To calculate the market size, the report considers the revenue generated from use of probe cards across several end-user industries.
The market is divided into the following segments based on geography:
‧ Americas
‧ APAC
‧ EMEA
Technavio's report, Global Probe Card Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
‧ FormFactor
‧ JAPAN ELECTRONIC MATERIALS
‧ MICRONICS JAPAN
‧ MPI
‧ Technoprobe
Market driver
‧ Miniaturization of electronic products
‧ For a full, detailed list, view our report
Market challenge
‧ Rapid technological changes in semiconductor industry
‧ For a full, detailed list, view our report
Market trend
‧ Growing adoption of 3-D NAND
‧ For a full, detailed list, view our report
Key questions answered in this report
‧ What will the market size be in 2022 and what will the growth rate be?
‧ What are the key market trends?
‧ What is driving this market?
‧ What are the challenges to market growth?
‧ Who are the key vendors in this market space?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
‧ Market ecosystem
‧ Market characteristics
‧ Market segmentation analysis
PART 05: MARKET SIZING
‧ Market definition
‧ Market sizing 2017
‧ Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
‧ Bargaining power of buyers
‧ Bargaining power of suppliers
‧ Threat of new entrants
‧ Threat of substitutes
‧ Threat of rivalry
‧ Market condition
PART 07: MARKET SEGMENTATION BY END-USER
‧ Segmentation by end-user
‧ Comparison by end-user
‧ Foundry and logic – Market size and forecast 2017-2022
‧ Memory device – Market size and forecast 2017-2022
‧ Market opportunity by end-user
PART 08: MARKET SEGMENTATION BY PRODUCT
‧ Segmentation by product
‧ Comparison by product
‧ Advanced probe card – Market size and forecast 2017-2022
‧ Standard probe card – Market size and forecast 2017-2022
‧ Market opportunity by product
PART 09: CUSTOMER LANDSCAPE
PART 10: REGIONAL LANDSCAPE
‧ Geographical segmentation
‧ Regional comparison
‧ APAC – Market size and forecast 2017-2022
‧ Americas – Market size and forecast 2017-2022
‧ EMEA – Market size and forecast 2017-2022
‧ Key leading countries
‧ Market opportunity
PART 11: DECISION FRAMEWORK
PART 12: DRIVERS AND CHALLENGES
‧ Market drivers
‧ Market challenges
PART 13: MARKET TRENDS
‧ Increasing wafer size
‧ Growing adoption of 3-D NAND
‧ Rise in M&A
PART 14: VENDOR LANDSCAPE
‧ Overview
‧ Landscape disruption
‧ Competitive scenario
PART 15: VENDOR ANALYSIS
‧ Vendors covered
‧ Vendor classification
‧ Market positioning of vendors
‧ FormFactor
‧ JAPAN ELECTRONIC MATERIALS
‧ MICRONICS JAPAN
‧ MPI
‧ Technoprobe
‧ List of abbreviations
Exhibit 01: Parent market
Exhibit 02: Global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition - Inclusions and exclusions checklist
Exhibit 06: Market size 2017
Exhibit 07: Validation techniques employed for market sizing 2017
Exhibit 08: Global probe card market – Market size and forecast 2017-2022 ($ mn)
Exhibit 09: Global probe card market – Year-over-year growth 2018-2022 (%)
Exhibit 10: Five forces analysis 2017
Exhibit 11: Five forces analysis 2022
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: Threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition - Five forces 2017
Exhibit 18: End-user – Market share 2017-2022 (%)
Exhibit 19: Comparison by end-user
Exhibit 20: Foundry and logic – Market size and forecast 2017-2022 ($ mn)
Exhibit 21: Foundry and logic – Year-over-year growth 2018-2022 (%)
Exhibit 22: Memory device – Market size and forecast 2017-2022 ($ mn)
Exhibit 23: Memory device – Year-over-year growth 2018-2022 (%)
Exhibit 24: Market opportunity by end-user
Exhibit 25: Product – Market share 2017-2022 (%)
Exhibit 26: Comparison by product
Exhibit 27: Advanced probe card – Market size and forecast 2017-2022 ($ mn)
Exhibit 28: Advanced probe card – Year-over-year growth 2018-2022 (%)
Exhibit 29: Standard probe card – Market size and forecast 2017-2022 ($ mn)
Exhibit 30: Standard probe card – Year-over-year growth 2018-2022 (%)
Exhibit 31: Market opportunity by product
Exhibit 32: Customer landscape
Exhibit 33: Global probe card market – Market share by geography 2017-2022 (%)
Exhibit 34: Regional comparison
Exhibit 35: APAC – Market size and forecast 2017-2022 ($ mn)
Exhibit 36: Major foundries in APAC
Exhibit 37: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 38: Americas – Market size and forecast 2017-2022 ($ mn)
Exhibit 39: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 40: EMEA – Market size and forecast 2017-2022 ($ mn)
Exhibit 41: List of foundries in EMEA
Exhibit 42: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 43: Key leading countries
Exhibit 44: Market opportunity
Exhibit 45: Increasing wafer size
Exhibit 46: Vendor landscape
Exhibit 47: Landscape disruption
Exhibit 48: Vendor share in the global probe card market 2017
Exhibit 49: Vendors covered
Exhibit 50: Vendor classification
Exhibit 51: Market Positioning of Vendors
Exhibit 52: FormFactor: Overview
Exhibit 53: FormFactor – Business segments
Exhibit 54: FormFactor – Organizational developments
Exhibit 55: FormFactor – Geographic focus
Exhibit 56: FormFactor – Segment focus
Exhibit 57: FormFactor – Key offerings
Exhibit 58: JAPAN ELECTRONIC MATERIALS: Overview
Exhibit 59: JAPAN ELECTRONIC MATERIALS – Business segments
Exhibit 60: JAPAN ELECTRONIC MATERIALS– Key offerings
Exhibit 61: MICRONICS JAPAN: Overview
Exhibit 62: MICRONICS JAPAN – Business segments
Exhibit 63: MICRONICS JAPAN – Geographic focus
Exhibit 64: MICRONICS JAPAN – Segment focus
Exhibit 65: MICRONICS JAPAN – Key offerings
Exhibit 66: MPI: Overview
Exhibit 67: MPI– Business segments
Exhibit 68: MPI – Geographic focus
Exhibit 69: MPI – Segment focus
Exhibit 70: MPI– Key offerings
Exhibit 71: Technoprobe: Overview
Exhibit 72: Technoprobe – Organizational developments
Exhibit 73: Technoprobe – Key offerings
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
‧ Market ecosystem
‧ Market characteristics
‧ Market segmentation analysis
PART 05: MARKET SIZING
‧ Market definition
‧ Market sizing 2017
‧ Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
‧ Bargaining power of buyers
‧ Bargaining power of suppliers
‧ Threat of new entrants
‧ Threat of substitutes
‧ Threat of rivalry
‧ Market condition
PART 07: MARKET SEGMENTATION BY END-USER
‧ Segmentation by end-user
‧ Comparison by end-user
‧ Foundry and logic – Market size and forecast 2017-2022
‧ Memory device – Market size and forecast 2017-2022
‧ Market opportunity by end-user
PART 08: MARKET SEGMENTATION BY PRODUCT
‧ Segmentation by product
‧ Comparison by product
‧ Advanced probe card – Market size and forecast 2017-2022
‧ Standard probe card – Market size and forecast 2017-2022
‧ Market opportunity by product
PART 09: CUSTOMER LANDSCAPE
PART 10: REGIONAL LANDSCAPE
‧ Geographical segmentation
‧ Regional comparison
‧ APAC – Market size and forecast 2017-2022
‧ Americas – Market size and forecast 2017-2022
‧ EMEA – Market size and forecast 2017-2022
‧ Key leading countries
‧ Market opportunity
PART 11: DECISION FRAMEWORK
PART 12: DRIVERS AND CHALLENGES
‧ Market drivers
‧ Market challenges
PART 13: MARKET TRENDS
‧ Increasing wafer size
‧ Growing adoption of 3-D NAND
‧ Rise in M&A
PART 14: VENDOR LANDSCAPE
‧ Overview
‧ Landscape disruption
‧ Competitive scenario
PART 15: VENDOR ANALYSIS
‧ Vendors covered
‧ Vendor classification
‧ Market positioning of vendors
‧ FormFactor
‧ JAPAN ELECTRONIC MATERIALS
‧ MICRONICS JAPAN
‧ MPI
‧ Technoprobe
‧ List of abbreviations
Exhibit 01: Parent market
Exhibit 02: Global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition - Inclusions and exclusions checklist
Exhibit 06: Market size 2017
Exhibit 07: Validation techniques employed for market sizing 2017
Exhibit 08: Global probe card market – Market size and forecast 2017-2022 ($ mn)
Exhibit 09: Global probe card market – Year-over-year growth 2018-2022 (%)
Exhibit 10: Five forces analysis 2017
Exhibit 11: Five forces analysis 2022
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: Threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition - Five forces 2017
Exhibit 18: End-user – Market share 2017-2022 (%)
Exhibit 19: Comparison by end-user
Exhibit 20: Foundry and logic – Market size and forecast 2017-2022 ($ mn)
Exhibit 21: Foundry and logic – Year-over-year growth 2018-2022 (%)
Exhibit 22: Memory device – Market size and forecast 2017-2022 ($ mn)
Exhibit 23: Memory device – Year-over-year growth 2018-2022 (%)
Exhibit 24: Market opportunity by end-user
Exhibit 25: Product – Market share 2017-2022 (%)
Exhibit 26: Comparison by product
Exhibit 27: Advanced probe card – Market size and forecast 2017-2022 ($ mn)
Exhibit 28: Advanced probe card – Year-over-year growth 2018-2022 (%)
Exhibit 29: Standard probe card – Market size and forecast 2017-2022 ($ mn)
Exhibit 30: Standard probe card – Year-over-year growth 2018-2022 (%)
Exhibit 31: Market opportunity by product
Exhibit 32: Customer landscape
Exhibit 33: Global probe card market – Market share by geography 2017-2022 (%)
Exhibit 34: Regional comparison
Exhibit 35: APAC – Market size and forecast 2017-2022 ($ mn)
Exhibit 36: Major foundries in APAC
Exhibit 37: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 38: Americas – Market size and forecast 2017-2022 ($ mn)
Exhibit 39: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 40: EMEA – Market size and forecast 2017-2022 ($ mn)
Exhibit 41: List of foundries in EMEA
Exhibit 42: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 43: Key leading countries
Exhibit 44: Market opportunity
Exhibit 45: Increasing wafer size
Exhibit 46: Vendor landscape
Exhibit 47: Landscape disruption
Exhibit 48: Vendor share in the global probe card market 2017
Exhibit 49: Vendors covered
Exhibit 50: Vendor classification
Exhibit 51: Market Positioning of Vendors
Exhibit 52: FormFactor: Overview
Exhibit 53: FormFactor – Business segments
Exhibit 54: FormFactor – Organizational developments
Exhibit 55: FormFactor – Geographic focus
Exhibit 56: FormFactor – Segment focus
Exhibit 57: FormFactor – Key offerings
Exhibit 58: JAPAN ELECTRONIC MATERIALS: Overview
Exhibit 59: JAPAN ELECTRONIC MATERIALS – Business segments
Exhibit 60: JAPAN ELECTRONIC MATERIALS– Key offerings
Exhibit 61: MICRONICS JAPAN: Overview
Exhibit 62: MICRONICS JAPAN – Business segments
Exhibit 63: MICRONICS JAPAN – Geographic focus
Exhibit 64: MICRONICS JAPAN – Segment focus
Exhibit 65: MICRONICS JAPAN – Key offerings
Exhibit 66: MPI: Overview
Exhibit 67: MPI– Business segments
Exhibit 68: MPI – Geographic focus
Exhibit 69: MPI – Segment focus
Exhibit 70: MPI– Key offerings
Exhibit 71: Technoprobe: Overview
Exhibit 72: Technoprobe – Organizational developments
Exhibit 73: Technoprobe – Key offerings
