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Global Soldering Equipment Market Research Report—Forecast till 2025

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出版日期:2020/08/01
頁  數:94頁
文件格式:PDF
價  格:
USD 4,450 (Single-User License)
USD 6,250 (Global-User License)
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Global Soldering Equipment Market Research Report—Forecast till 2025

Market Overview
Global Soldering Equipment Market is anticipated to witness a substantial market expansion of a CAGR of 9.56% to surpass a value of USD 911.3 Million during the research period. The major companies worldwide highlight product innovation and development to gratify enterprises across every industry vertical. These equipment are applicable in various ends use industries such as automotive, energy & power, aerospace & defense, communication, and electricals & electronics. The rapid industrialization and increased manufacturing of electronic products and printed circuit boards (PCBs) are expected to gain s significant market expansion.
The global soldering equipment market growth is expected to register an incredible market surge during the study period owing to the growing preference and demand for advanced electronic products. Additionally, the increasing urbanization and growing per capita disposable income among individuals are expected to create opportunities for the market players during the forecast period. Moreover, Rapid technological advancements have resulted in many industries adopting new technologies and electrification to improve the overall performance of the industries in terms of production and energy efficiency. The industries adopting new technologies and electrification to enhance the overall performance of the industries in terms of production and energy efficiency.
Market Segmentation
Global Soldering Equipment Market is categorized into Type, Application, and Region.
By Type segment, the global market has been classified into reflow soldering, induction soldering, hot-bar reflow, laser soldering, and mechanical and aluminum soldering.
In terms of the application segment, the global soldering equipment market has been divided into consumer electronics, networking & communication, automotive, aerospace & defense, and others.
Regional Analysis
Geographically, the Global Soldering Equipment Market has been segmented into North America, Europe, Asia-Pacific, and the rest of the world.
Asia-Pacific is expected to dominate the soldering equipment market during the study, due to the rise in foreign investments in developing the electric vehicle (EV) charging infrastructure owing to the significant population base and the developing economies of China, India, Japan, and Thailand. China is expected to exhibit the largest market of the Asia-Pacific share and is expected to expand rapidly over the review period owing to the increasing per capita disposable income and the expanding automotive and consumer electronics sectors. Moreover, the rising focus of the governments towards strengthening the manufacturing facilities in emerging countries such as India and China is propelling the dominance of the region in the soldering equipment market.
North America is registering the second-largest regional market for soldering equipment and is expected to witness substantial growth owing to the high demand for electronic equipment is high in the region. The US contributes the largest share of the global market owing to its developed economy and growing industries such as consumer electronics and aerospace & defense.
Key Competitors
The major market players are Ersa GmbH, Pillarhouse International Ltd., RPS Automation LLC, FLASON ELECTRONIC CO. LIMITED, JBC S.L, SEHO Systems GmbH, ACE Production Technologies, Inc., Blundell Production Equipment Ltd, American Hakko Products, Inc., JUKI Automation, PACE Europe Ltd., The Harris Products Group, Inductelec Limited, JAPAN UNIX Co. Ltd, and RADYNE CORPORATION.
COVID 19 Impacts
We are continuously tracking the impact of the COVID-19 pandemic on various industries and verticals within all domains. Our research reports include the same and help you understand the drop and rise, owing to the impact of COVID-19 on the industries. Also, we help you to identify the gap between the demand and supply of your interested market. Moreover, the report helps you with the analysis, amended government regulations, and many other useful insights.
TABLE OF CONTENT
1 EXECUTIVE SUMMARY
1.1 MARKET SUMMARY

2 MARKET INTRODUCTION
2.1 DEFINITION

2.2 SCOPE OF THE STUDY

2.3 MARKET STRUCTURE

3 RESEARCH METHODOLOGY
4 MARKET DYNAMICS
4.1 INTRODUCTION

4.2 DRIVERS

4.2.1 GROWING INDUSTRIALIZATION

4.2.2 INCREASED MANUFACTURING OF ELECTRONIC PRODUCTS AND PRINTED CIRCUIT BOARDS (PCBS)

4.3 RESTRAINTS

4.3.1 LACK OF SKILLED PROFESSIONALS

4.3.2 VOLATILE RAW MATERIAL PRICES

4.4 OPPORTUNITY

4.4.1 BROADENING SCOPE IN EMERGING ECONOMIES

4.5 COVID-19 IMPACT ANALYSIS

4.5.1 ECONOMIC IMPACT ON THE OVERALL MANUFACTURING INDUSTRY

4.6 IMPACT ON THE GLOBAL SOLDERING EQUIPMENT MARKET

4.6.1 IMPACT ON SUPPLY CHAIN

4.6.2 PRICE VARIATION OF KEY RAW MATERIALS

4.6.3 PRODUCTION SHUTDOWN

4.6.4 IMPACT ON MARKET DEMAND

5 MARKET FACTOR ANALYSIS
5.1 SUPPLY CHAIN ANALYSIS

5.1.1 DESIGN & DEVELOPMENT

5.1.2 COMPONENT SUPPLY

5.1.3 SOLDERING EQUIPMENT MANUFACTURING

5.1.4 SUPPLY & DISTRIBUTION

5.1.5 END USE

5.2 PORTERS FIVE FORCES

5.2.1 THREAT OF NEW ENTRANTS

5.2.2 BARGAINING POWER OF SUPPLIERS

5.2.3 THREAT OF SUBSTITUTES

5.2.4 BARGAINING POWER OF BUYERS

5.2.5 INTENSITY OF RIVALRY

6 GLOBAL SOLDERING EQUIPMENT MARKET, BY TYPE
6.1 OVERVIEW

6.1.1 MARKET ESTIMATES & FORECAST, 2017-2025

6.2 INDUCTION SOLDERING

6.3 REFLOW SOLDERING

6.4 HOT-BAR REFLOW

6.5 LASER SOLDERING

6.6 MECHANICAL AND ALUMINIUM SOLDERING

7 GLOBAL SOLDERING EQUIPMENT MARKET, BY APPLICATION
7.1 OVERVIEW

7.1.1 MARKET ESTIMATES & FORECAST, 2017-2025

7.2 NETWORKING & COMMUNICATION

7.3 CONSUMER ELECTRONICS

7.4 AUTOMOTIVE

7.5 AEROSPACE & DEFENCE

7.6 OTHERS

8 GLOBAL SOLDERING EQUIPMENT MARKET, BY REGION
8.1 OVERVIEW

8.1.1 MARKET ESTIMATES & FORECAST, 2017-2025

8.2 NORTH AMERICA

8.2.1 US

8.2.2 CANADA

8.2.3 MEXICO

8.3 EUROPE

8.3.1 UK

8.3.2 GERMANY

8.3.3 FRANCE

8.3.4 ITALY

8.3.5 REST OF EUROPE

8.4 ASIA-PACIFIC

8.4.1 CHINA

8.4.2 JAPAN

8.4.3 INDIA

8.4.4 REST OF ASIA-PACIFIC

8.5 REST OF THE WORLD

8.5.1 MIDDLE EAST & AFRICA

8.5.2 SOUTH AMERICA

9 COMPETITIVE LANDSCAPE
9.1 COMPETITIVE OVERVIEW

9.2 MAJOR PLAYERS MARKET SHARE ANALYSIS

9.3 COMPETITIVE BENCHMARKING

9.4 KEY DEVELOPMENTS AND GROWTH STRATEGIES

9.5 COMPETITOR DASHBOARD

10 COMPANY PROFILES
10.1 KURTZ ERSA, INC.

10.1.1 COMPANY OVERVIEW

10.1.2 FINANCIAL OVERVIEW

10.1.3 PRODUCTS OFFERED

10.1.4 KEY STRATEGIES

10.2 PILLARHOUSE INTERNATIONAL LTD.

10.2.1 COMPANY OVERVIEW

10.2.2 FINANCIAL OVERVIEW

10.2.3 PRODUCTS OFFERED

10.2.4 KEY DEVELOPMENTS

10.2.5 KEY STRATEGIES

10.3 RPS AUTOMATION

10.3.1 COMPANY OVERVIEW

10.3.2 FINANCIAL OVERVIEW

10.3.3 PRODUCTS OFFERED

10.3.4 KEY DEVELOPMENTS

10.3.5 KEY STRATEGIES

10.4 FLASON ELECTRONIC CO. LIMITED

10.4.1 COMPANY OVERVIEW

10.4.2 FINANCIAL OVERVIEW

10.4.3 PRODUCTS OFFERED

10.4.4 KEY DEVELOPMENTS

10.4.5 KEY STRATEGIES

10.5 JBC S.L

10.5.1 COMPANY OVERVIEW

10.5.2 FINANCIAL OVERVIEW

10.5.3 PRODUCTS OFFERED

10.5.4 KEY DEVELOPMENTS

10.5.5 KEY STRATEGIES

10.6 SEHO SYSTEMS GMBH

10.6.1 COMPANY OVERVIEW

10.6.2 FINANCIAL OVERVIEW

10.6.3 PRODUCTS OFFERED

10.6.4 KEY DEVELOPMENTS

10.6.5 KEY STRATEGIES

10.7 ACE PRODUCTION TECHNOLOGIES, INC.

10.7.1 COMPANY OVERVIEW

10.7.2 FINANCIAL OVERVIEW

10.7.3 PRODUCTS OFFERED

10.7.4 KEY DEVELOPMENTS

10.8 BLUNDELL PRODUCTION EQUIPMENT LTD

10.8.1 COMPANY OVERVIEW

10.8.2 FINANCIAL OVERVIEW

10.8.3 PRODUCTS OFFERED

10.8.4 KEY DEVELOPMENTS

10.9 AMERICAN HAKKO PRODUCTS, INC.

10.9.1 COMPANY OVERVIEW

10.9.2 FINANCIAL OVERVIEW

10.9.3 PRODUCTS OFFERED

10.9.4 KEY DEVELOPMENTS

10.10 JUKI AUTOMATION

10.10.1 COMPANY OVERVIEW

10.10.2 FINANCIAL OVERVIEW

10.10.3 PRODUCTS OFFERED

10.10.4 KEY DEVELOPMENTS

10.11 PACE EUROPE LTD.

10.11.1 COMPANY OVERVIEW

10.11.2 FINANCIAL OVERVIEW

10.11.3 PRODUCTS OFFERED

10.11.4 KEY DEVELOPMENTS

10.12 THE HARRIS PRODUCTS GROUP

10.12.1 COMPANY OVERVIEW

10.12.2 FINANCIAL OVERVIEW

10.12.3 PRODUCTS OFFERED

10.12.4 KEY DEVELOPMENTS

10.12.5 SWOT ANALYSIS

10.12.6 KEY STRATEGIES

10.13 INDUCTELEC LIMITED

10.13.1 COMPANY OVERVIEW

10.13.2 FINANCIAL OVERVIEW

10.13.3 PRODUCTS OFFERED

10.13.4 KEY DEVELOPMENTS

10.14 JAPAN UNIX CO. LTD

10.14.1 COMPANY OVERVIEW

10.14.2 FINANCIAL OVERVIEW

10.14.3 PRODUCTS OFFERED

10.14.4 KEY DEVELOPMENTS

10.15 RADYNE CORPORATION

10.15.1 COMPANY OVERVIEW

10.15.2 FINANCIAL OVERVIEW

10.15.3 PRODUCTS OFFERED

10.15.4 KEY DEVELOPMENTS





























































































































































































































































































































































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