Advanced IC Packaging Market Research Report by Type, Application, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19

The Global Advanced IC Packaging Market size was estimated at USD 37.87 billion in 2021 and expected to reach USD 40.94 billion in 2022, and is projected to grow at a CAGR 8.28% to reach USD 61.06 billion by 2027.

Market Statistics:
The report provides market sizing and forecast across 7 major currencies - USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:
This research report categorizes the Advanced IC Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Type, the market was studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.

Based on Application, the market was studied across Aerospace and Defense, Automotive and Transportation, IT and Telecom, and Mobile and Consumer.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Advanced IC Packaging market considering the current update on the conflict and its global response.

Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Advanced IC Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Advanced IC Packaging Market, including 3D Plus, Inc., Advanced Semiconductor Engineering Inc., Amkor Technology, Inc., Analog Devices, Inc., Carsem, Inc., CONNECTEC Japan Corporation, Intel Corporation, International Business Machines Corporation, Microchip Technology Inc., Qualcomm Technologies, Inc., Renesas Electronics, Samsung Electronics Co., Ltd, Taiwan Semiconductor Manufacturing Company, Limited, Texas Instruments, and Toshiba Corporation.

The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:
1. What is the market size and forecast of the Global Advanced IC Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Advanced IC Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Advanced IC Packaging Market?
4. What is the competitive strategic window for opportunities in the Global Advanced IC Packaging Market?
5. What are the technology trends and regulatory frameworks in the Global Advanced IC Packaging Market?
6. What is the market share of the leading vendors in the Global Advanced IC Packaging Market?
7. What modes and strategic moves are considered suitable for entering the Global Advanced IC Packaging Market?

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing availability of wide range of consumer electronic devices
5.1.1.2. Developing IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages
5.1.1.3. Growing demand for consumer wearable devices, home appliances, and smartphones
5.1.2. Restraints
5.1.2.1. Lack of technological experts
5.1.3. Opportunities
5.1.3.1. Evolving consumer preferences and choices in terms of latest gadgets and technology coupled with constant innovation in the field of consumer electronics
5.1.3.2. Introduction of packaging technologies supporting IoT driven IC industry
5.1.4. Challenges
5.1.4.1. Big data requirement
5.2. Cumulative Impact of COVID-19

6. Advanced IC Packaging Market, by Type
6.1. Introduction
6.2. 2.5D Integrated Circuit
6.3. 2D Integrated Circuit
6.4. 3D Integrated Circuit
6.5. Fan Out Silicon In Package
6.6. Fan Out Wafer Level Package
6.7. Flip Chip
6.8. Wafer Level Chip Scale Package

7. Advanced IC Packaging Market, by Application
7.1. Introduction
7.2. Aerospace and Defense
7.3. Automotive and Transportation
7.4. IT and Telecom
7.5. Mobile and Consumer

8. Americas Advanced IC Packaging Market
8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States

9. Asia-Pacific Advanced IC Packaging Market
9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam

10. Europe, Middle East & Africa Advanced IC Packaging Market
10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom

11. Competitive Landscape
11.1. FPNV Positioning Matrix
11.1.1. Quadrants
11.1.2. Business Strategy
11.1.3. Product Satisfaction
11.2. Market Ranking Analysis, By Key Player
11.3. Market Share Analysis, By Key Player
11.4. Competitive Scenario
11.4.1. Merger & Acquisition
11.4.2. Agreement, Collaboration, & Partnership
11.4.3. New Product Launch & Enhancement
11.4.4. Investment & Funding
11.4.5. Award, Recognition, & Expansion

12. Company Usability Profiles
12.1. 3D Plus, Inc.
12.1.1. Business Overview
12.1.2. Key Executives
12.1.3. Product & Services
12.2. Advanced Semiconductor Engineering Inc.
12.2.1. Business Overview
12.2.2. Key Executives
12.2.3. Product & Services
12.3. Amkor Technology, Inc.
12.3.1. Business Overview
12.3.2. Key Executives
12.3.3. Product & Services
12.4. Analog Devices, Inc.
12.4.1. Business Overview
12.4.2. Key Executives
12.4.3. Product & Services
12.5. Carsem, Inc.
12.5.1. Business Overview
12.5.2. Key Executives
12.5.3. Product & Services
12.6. CONNECTEC Japan Corporation
12.6.1. Business Overview
12.6.2. Key Executives
12.6.3. Product & Services
12.7. Intel Corporation
12.7.1. Business Overview
12.7.2. Key Executives
12.7.3. Product & Services
12.8. International Business Machines Corporation
12.8.1. Business Overview
12.8.2. Key Executives
12.8.3. Product & Services
12.9. Microchip Technology Inc.
12.9.1. Business Overview
12.9.2. Key Executives
12.9.3. Product & Services
12.10. Qualcomm Technologies, Inc.
12.10.1. Business Overview
12.10.2. Key Executives
12.10.3. Product & Services
12.11. Renesas Electronics
12.11.1. Business Overview
12.11.2. Key Executives
12.11.3. Product & Services
12.12. Samsung Electronics Co., Ltd
12.12.1. Business Overview
12.12.2. Key Executives
12.12.3. Product & Services
12.13. Taiwan Semiconductor Manufacturing Company, Limited
12.13.1. Business Overview
12.13.2. Key Executives
12.13.3. Product & Services
12.14. Texas Instruments
12.14.1. Business Overview
12.14.2. Key Executives
12.14.3. Product & Services
12.15. Toshiba Corporation
12.15.1. Business Overview
12.15.2. Key Executives
12.15.3. Product & Services

13. Appendix
13.1. Discussion Guide
13.2. License & Pricing