Compound Semiconductor Industry Review July - September 2012: Microelectronics

Financial results for microelectronics companies in the second calendar quarter of 2012 indicate sequential growth in the market. While this is a positive result, revenue is down versus the same period in 2011, lending credence to the thesis that overall growth in 2012 will be small. Product announcements remain high, with silicon-based CMOS, SiC and GaN-on-silicon developments seeing a lot of activity.

1 Executive Summary
2 Introduction
3 MMICs
3.1 Company Results
3.1.1 Skyworks Reports Q3 FY 2012 Results
3.1.2 Fairchild Reports Q2 FY 2012 Results
3.1.3 Freescale Reports Q2 FY 2012 Results
3.1.4 RFMD Q1 FY 2013 Results
3.1.5 TriQuint Q2 FY 2012 Results
3.1.6 Northrop Grumman Q2 FY 2012 Results
3.1.7 Raytheon Q2 FY 2012 Results
3.1.8 Hittite Reports Q2 FY 2012 Results
3.1.9 Microsemi Q3 FY 2012 Results
3.1.10 Fujitsu Q1 FY 2012 Results
3.1.11 Toshiba Q1 FY 2011 Results
3.1.12 ANADIGICS Q2 FY 2012 Results
3.1.13 Sumitomo Electric Q1 FY 2013 Results
3.1.14 Renesas Reports Q1 FY 2013 Financials
3.1.15 Agilent Reports Q3 '12 Financials
3.1.16 Skyworks Updates Revenue and Earnings Outlook
3.2 Contracts
3.2.1 ANADIGICS Powers Samsung Galaxy SR III
3.2.2 RFMD Commences LTE Shipments to Samsung
3.2.3 Comtech Telecommunications Receives $3.1 Million Contract
3.2.4 Samsung Selects RFMD PowerSmart for Next-Generation GALAXY Note II
3.2.5 ANADIGICS' MMPA Powers Samsung Galaxy S Relay 4G
3.3 New Products
3.3.1 RFMD Introduces Wi-Fi Front End Module
3.3.2 Hittite LNA Covers 0.3 - 3 GHz in a 4.5 mm2 Package
3.3.3 Skyworks Introduces Analog Solutions for Automotive Toll Tag Systems
3.3.4 RFMD Introduces 5-Bit Serial-Controlled Digital Step Attenuators
3.3.5 Hittite Announces Wideband Downconverter RFIC
3.3.6 RFMD Releases 0.25W InGaP HBT Power Amplifier
3.3.7 Hittite Launches 2 - 18 GHz Double-Balanced Mixer
3.3.8 Hittite Wideband LNA & Power Amplifiers Cover DC to 28 GHz
3.3.9 M/A-COM Tech Develops Push-Pull CATV Amplifier
3.3.10 Hittite Introduces Analog-to-Digital Converters
3.3.11 TriQuint Introduces Driver Amplifier
3.3.12 Hittite Releases 3.3V Clock Generators
3.3.13 Hittite Introduces Hermetically Sealed Connectorized Modules
3.3.14 RFMD Develops Single Junction Drop-In Circulators
3.3.15 GigOptix Announces E-band Power Detector
3.3.16 M/A-COM Technology Solutions Develops 8W Power Amplifier
3.3.17 RFMD Releases 6-Bit Serial-Controlled Digital Step Attenuators
3.3.18 EPC Demonstrates eGaN FET Wireless Power
3.3.19 RFMD Introduces Transmit/Receive Module
3.3.20 M/A-COM Tech Introduces GaAs MMIC Doubler with Integrated Driver Stages
3.3.21 Hittite Introduces 9 -14 GHz PA Family
3.3.22 TriQuint Releases SAW Delay Lines
3.3.23 Microsemi Releases RF Transistor for Radar Applications
3.3.24 TriQuint Releases Base Station Driver Amplifiers
3.3.25 ANADIGICS Introduces Dual-Band ProEficientTM Power Amplifiers
3.3.26 TriQuint RF Chipset Targets VSAT Applications
3.3.27 Mitsubishi Electric Develops Ku-band 50W GaN HEMT
3.3.28 M/A-COM Tech Develops Transimpedance Amplifiers for 100G Applications
3.3.29 M/A-COM Tech Introduces Modulator Drivers for 100G Applications
3.3.30 TriQuint Announces Multi-Band, Multi-Mode PA
3.3.31 Richardson RFPD Announces 30W GaN PA from TriQuint
3.3.32 UMS Develops Variable Gain Amplifier
3.3.33 RFMD Develops ISM Band Tx/Rx Module
3.3.34 Exodus Dynamics Develops Dual Frequency Phase Locked DRO
3.4 Other
3.4.1 TriQuint's TRITIUM Duo PADs Named Most Valuable Product
3.4.2 Eyelit's Integrated MES Software Chosen by GCS to Replace Legacy System
3.4.3 Richardson RFPD Named Top Technical Support Distributor in China
3.4.4 GigOptix Litigation against M/A-Com (Optomai) Update
3.4.5 DARPA Solid State Receiver Demonstrates Gain at 0.85 THz
3.4.6 TriQuint Expands its Board of Directors
3.4.7 RFMD'S CATV Amplifiers Receive "Product of the Year" Awards
3.4.8 Hittite & Digi-Key Announce Global Distribution Agreement
3.4.9 GigOptix Signs Distributor Agreement with Altima for Japanese Market
3.4.10 Transphorm Chosen by World Economic Forum as 2013 Technology Pioneer
3.4.11 M/A-COM Tech & Optomai Announce Favorable Court Ruling in GigOptix Case
3.4.12 TriQuint Wins DARPA GaN RF Power Amplifier Contract
3.4.13 TriQuint Selected as Finalist for Two Communications Technology Awards
4 Silicon Devices
4.1 Company Results
4.1.1 IXYS Corporation Reports Q3 '12 Financials
4.1.2 Peregrine Raises $77 Million in IPO
4.1.3 Vitesse Third Quarter 2012 Results
4.1.4 TowerJazz Reports Q2 '12 Financials
4.1.5 Analog Devices Reports Q3 '12 Financials
4.2 New Products
4.2.1 Microsemi Introduces Radiation-Tolerant Source Driver
4.2.2 Renesas Introduces SiGe:C Transistor
4.2.3 Intel Announces Integration of HSPA Transceiver with PA
4.2.4 Vitesse Extends Retimer Family
4.2.5 M/A-COM Tech Introduces High Voltage CMOS Driver for PIN Diodes
4.2.6 Skyworks Announces LED Camera Flash Drivers
4.2.7 Peregrine Semiconductor Introduces SPDT RF Switch for Vehicles
4.2.8 Rohm Launches SiC Power MOSFET with Internal Schottky Diode
4.2.9 Cree Introduces 150mm 4HN Silicon Carbide Epiwafers
4.2.10 GeneSiC Thyristors Reach Higher Performance Levels
4.2.11 STMicroelectronics Develop SiC Solutions for Solar Applications
4.2.12 Peregrine Semiconductor Announces SPDT RF Switches
4.3 Other
4.3.1 AIXTRON Launches BM 300T Carbon Nanotubes System
4.3.2 Mitsubishi Electric to Ship SiC Power Module Samples
4.3.3 Amalfi Semiconductor Ships More Than 100 Million CMOS PAs
4.3.4 Australian University Funded for SiC Electronics
4.3.5 ATMI and IBM Enter Joint Agreement for Wet Processing
4.3.6 Accel-RF Changes Name
4.3.7 HRL Demonstrates Millimeter Wave Detectors Using Graphene
4.3.8 TowerJazz Expands Vishay Deal
4.3.9 Tahoe Announces RF Radio-On-A-Chip Architecture
4.3.10 Mitsubishi Electric Receives Green Designation
4.3.11 Tahoe Receives RF Innovation Grant
4.3.12 Samsung Picks Javelin CMOS PAs for Galaxy S Duos Smartphone
4.3.13 RFaxis Starts Production of Seven New CMOS RFeICs
4.3.14 Fujitsu Develops On-Chip CMOS Power Detector with Temperature Compensation
4.3.15 TowerJazz and Modiotek Partner on Next Gen DSP
4.3.16 Peregrine Semiconductor & RFMW Finalize Global Distribution Agreement
4.3.17 Silicon Labs Introduces CMOS Drop-in Digital Isolators