2015/08/13 Demand for More Information and Enhanced Graphics Driving Growth in Automotive Instrument Clusters says Strategy Analytics
by Kevin Mak | Aug 10, 2015 Leave a comment
Combined Demand for High-Level Hybrid and Solid State Clusters will Increase from 9.2M to 38.3M Units By 2022
The Strategy Analytics Automotive Electronics Service (AES) report, Automotive Instrument Clusters: Component Integration, Display Panels and Software Drive Developments, comments on the design trends in the cluster and how vendors are supporting them.
Click here for the report: http://bit.ly/1Rgkrk1
Multi-core SoCs (Systems-on-Chip) are used now to process the increasing levels of data and to control more complicated clusters. However, these SoCs will be designed as platforms on which the various levels of cluster systems can be based in order to enable economies of scale. “Chip vendors are typically targeting the mass market cluster first, before adding dynamic memory and graphics engines to serve the high-end clusters” said Kevin Mak, Senior Analyst in the Automotive Electronics Service (AES) at Strategy Analytics.”
As new solid state clusters enter the market with 3D graphics to mimic the chrome detail of previous stepper motor gauges along with driver settings that can display navigation directions on a large detailed map, the requirement of graphics performance will increase even further. This will enable the entry of new chip players, such as NVIDIA and its new Tegra X1 processor. Such a device can also integrate the processing requirements for all the display panels in the vehicle, including the CID, head-up display and rear seat entertainment systems – such function integration onto a single chip may provide a solution for auto makers that are keen to enhance their future infotainment and cluster offerings.
Source: Strategy Analytics
