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組織/文章編號
IEC
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  • 【組  織】IEC
  • 【文件編號】IEC 60364-7-740
  • Electrical Installations of Buildings - Part 7-740: Requirements for Special Installations or Locations - Temporary Electrical Installations for Structures, Amusement Devices and Booths at Fairgrounds, Amusement Parks and Circuses - Edition 1.0

  • 【日  期】2000/10/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC 60489-8
  • Methods of measurement for radio equipment used in the mobile services Part 8: Methods of measurement for antennas and ancillary equipment - Edition 1.0; Includes Amendment 1: 10/2000

  • 【日  期】2000/10/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC 61577-2
  • Radiation Protection Instrumentation - Radon and Radon Decay Product Measuring Instruments - Part 2: Specific Requirements for Radon Measuring Instruments - Edition 2.0

  • 【日  期】2000/10/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC 60191-6-3
  • Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP) - Edition 1.0

  • 【日  期】2000/9/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC TR 60870-1-5
  • Telecontrol Equipment and Systems - Part 1-5: General Considerations - Influence of Modem Transmission Procedures with Scramblers on the Data Integrity of Transmission Systems Using the Protocol IEC 60870-5 - Edition 1.0

  • 【日  期】2000/9/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC 60191-2Z
  • Twenty-fourth supplement to Publication 60191-2 (1966) Mechanical standardization of semiconductor devices – Part 2: Dimensions - Edition 1.0

  • 【日  期】2000/9/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC 60603-2 AMD 1
  • Amendment 1 Connectors for Frequencies Below 3 MHz for Use with Printed Boards - Part 2: Detail Specification for Two-Part Connectors with Assessed Quality, for Printed Boards, for Basic Grid of 2,54 mm (0,1 in) with Common Mounting Features - Edition 3.0

  • 【日  期】2000/8/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC 61000-4-29
  • Electromagnetic Compatibility (EMC) - Part 4-29: Testing and Measurement Techniques - Voltage Dips, Short Interruptions and Voltage Variations on d.c. Input Power Port Immunity Tests - Edition 1.0

  • 【日  期】2000/8/1
  • 【語  言】English; French
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC PAS 62162
  • Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components - Edition 1.0

  • 【日  期】2000/8/1
  • 【語  言】English
  • 【狀  態】Active
  • 【組  織】IEC
  • 【文件編號】IEC 60368-4
  • Piezoelectric Filters of Assessed Quality - Part 4: Sectional Specification - Capability Approval - Edition 1.0

  • 【日  期】2000/8/1
  • 【語  言】English; French
  • 【狀  態】Active